Principal SoC Design Engineer, HBM

Micron • Richardson, TX

23h

About The Position

Micron Technology is a world leader in innovating memory and storage solutions. As an SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet aggressive power, performance, area, and schedule targets. This is a hands‑on technical role focused on RTL design, IP integration, debug, and pre‑/post‑silicon support.

Requirements

• Strong experience in digital SoC design and RTL development.
• Proficiency in SystemVerilog/Verilog and familiarity with SoC integration methodologies.
• Experience with the RTL‑to‑GDS flow, including synthesis, static timing analysis, and design sign‑off considerations.
• Working knowledge of design verification concepts and debug workflows.
• Experience integrating complex IP blocks into large SoCs; familiarity with EDA tools from Cadence, Synopsys, and/or Siemens; programming or scripting experience (e.g., Python, TCL, Perl, or shell scripting); ability to work effectively in a global, cross‑functional engineering environment; strong analytical and problem‑solving skills with attention to detail.

Nice To Haves

• Experience with HBM, DRAM, or memory‑centric SoC designs.
• Familiarity with high‑speed interfaces, clocking strategies, reset architectures, and power management concepts.
• Exposure to DFT concepts (scan, MBIST, BIRA/BISR) and debug.
• Experience with hardware emulation or acceleration platforms (e.g., Palladium, Veloce, Zebu).
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field; minimum 10 years of experience in a related field; proven ability to mentor and develop junior engineers.

Responsibilities

• Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die.
• Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic).
• Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations.
• Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure.
• Support design verification through debug of simulation, emulation, and formal results; resolve functional, performance, and connectivity issues.
• Work closely with physical design teams to address synthesis, timing, power, and floorplanning considerations.
• Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues.
• Contribute to design documentation, block specifications, design reviews, and collaborate cross‑functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable designs; continuously improve design quality, reusability, and development efficiency through best practices and automation.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Principal