Senior SOC Physical Design Engineer, HBM

Micron Technology • Richardson, TX

2d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. You will drive physical implementation of advanced high‑bandwidth memory (HBM) system‑on‑chip (SoC) logic and base die designs from netlist through GDSII within the Heterogeneous Integration Group. You will collaborate closely with design, verification, design for test (DFT), packaging, and manufacturing teams to deliver best‑in‑class performance, power, and area (PPA) with robust signoff collateral. This is a hands‑on role where you can own blocks or top‑level integration across multiple product generations and see your work through tapeout and silicon.

Requirements

• Hands‑on experience with industry electronic design automation tools such as Innovus, Fusion Compiler, IC Validator (ICV), or Calibre for physical design and signoff.
• Solid understanding of static timing analysis fundamentals, clocking concepts, and Synopsys Design Constraints (SDC).
• Working knowledge of power intent methodologies including Unified Power Format (UPF) or Common Power Format (CPF), power grid planning, and basic power integrity considerations.
• Familiarity with physical verification and signoff flows including design rule checking, layout versus schematic, and parasitic awareness.
• Experience with hierarchical physical design and system‑on‑chip integration methodologies.

Nice To Haves

• Experience with HBM or dynamic random‑access memory (DRAM) adjacent SoC designs or memory‑subsystem‑heavy SoCs.
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
• Minimum three to five years of experience in a related physical design or SoC implementation role.
• Experience with signal integrity and reliability analysis including IR drop and electromigration using tools such as Ansys.
• Experience developing or using Tcl or Python scripts to automate physical design checks, reporting, and flow improvements.

Responsibilities

• Support physical implementation of SoC blocks from floorplanning through placement, clock tree synthesis (CTS), routing, and optimization to meet performance, power, and area targets.
• Assist with setup and hold timing closure across multi‑mode, multi‑corner (MMMC) scenarios using industry tools such as PrimeTime or Tempus under guidance of senior engineers.
• Collaborate with RTL design and integration teams to ensure correct clocking, reset strategies, and power intent implementation throughout the design.
• Integrate and implement complex intellectual property (IP) blocks including controllers, interfaces, memory built‑in self‑test (MBIST), design for test (DFT) logic, buffers, and PHY‑adjacent logic with focus on timing and physical correctness.
• Run and debug physical signoff checks such as design rule checking (DRC), layout versus schematic (LVS), and timing signoff, addressing violations with support from signoff experts.
• Work with DFT teams to ensure scan and MBIST logic are physically clean and do not negatively impact timing, congestion, or routability.
• Participate in tapeout readiness activities including engineering change order (ECO) flows, checklists, design reviews, and post‑silicon debug by correlating silicon behavior with physical design, static timing analysis, and power analysis.
• Apply hands‑on experience with electronic design automation tools and methodologies while working effectively in a cross‑functional, global team environment.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Associate degree