Principal Product Engineer

Microsoft•Raleigh, NC

6h•$142,800 - $304,200

About The Position

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) powers Microsoft’s cloud infrastructure and supports its online businesses and Azure platform. The Compute Silicon & Manufacturing Engineering organization designs, develops, manufactures, and packages Microsoft computer chips, including Azure Cobalt. Within this organization, the Silicon, Manufacturing, and Packaging Engineering team defines and delivers operational measures for cloud hardware manufacturing, with a focus on planning, quality, delivery, scale, and sustainability. Key initiatives include Azure and Azure MAIA AI. The Principal Product Engineer is responsible for product and test engineering for new product development and manufacturing. This is an end-to-end product engineering role, taking products from definition through launch. The engineer drives readiness, testing, bring-up, performance optimization, manufacturing requirements, and cross-functional work across pre-silicon and post-silicon development phases.

Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or a related field and 3+ years of technical engineering experience; or a master's degree in one of these fields and 6+ years of experience; or a bachelor's degree in one of these fields and 8+ years of experience; or equivalent experience.
Experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.
Excellent knowledge of ATE test program development, including test method development, test bring-up, characterization, debug, and yield analysis.
Knowledge of DFT, silicon fabrication processes, product quality and reliability, and basic transistor theory.
Ability to meet Microsoft, customer, and/or government security screening requirements, including the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter.
Ability to satisfy applicable export-control eligibility requirements; citizenship or other qualifying status will be verified as a condition of employment.

Nice To Haves

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or a related field and 5+ years of technical engineering experience; or a master's degree in one of these fields and 8+ years of experience; or a bachelor's degree in one of these fields and 12+ years of experience; or equivalent experience.
At least 1 year of experience working on or leading projects from beginning to end.
8+ years of product development and manufacturing experience in large-scale or high-performance products, such as AI, machine learning, neural networks, CPUs, or high-power SoCs/chips.
8+ years of experience developing integrated circuits, including pre-silicon development, first-silicon bring-up, and new product introduction.
5+ years of product and test engineering experience specializing in ATE test program development.
Strong presentation and communication skills.
Experience leading cross-functional teams and understanding program or project management.
Experience managing supply chains, vendors or partners, and integrated-circuit production.
Experience gathering system and customer requirements and interfacing with customers.
Experience in silicon configuration (SKU) management and internal supplier/customer interfacing.
Experience with end-to-end product development flow and driving sample-delivery milestones across the lifecycle.
Knowledge of power and performance modeling for ATE binning optimization in pre- and post-silicon phases, including ATE power/performance binning implementation and required characterization data collection.
Knowledge of yield recovery definition and implementation, including redundancy and repair for logic, arrays, and analog.
Electrical engineering and/or device physics background.
System and platform validation background.
Experience validating and characterizing products across ATE, RVP, and customer-board platforms.
Experience with failure analysis, qualification, and yield analysis.
Strong probability and statistics background, including design of experiments (DOEs).
Experience with product and test engineering and ATE test program methodologies; Advantest V93K experience is a plus.
Knowledge of DFT and DFM techniques.
Understanding of bring-up, debug, characterization, and manufacturing testing on ATEs.
Computer architecture fundamentals.
Strong unit and integration testing skills.
Background in debugging and optimizing software.
Demonstrated adaptability, growth mindset, customer focus, drive for results, ability to influence, and sound judgment.
Background in high-performance computing, AI, GPUs, or CPUs.

Responsibilities

Own product and test engineering for new product development and manufacturing.
Drive pre-silicon readiness for power, performance, thermal, and power-delivery-related tests and features, including LDOs and integrated voltage regulators, to support successful power-on bring-up.
Drive post-silicon power and performance tuning in partnership with platform teams.
Drive ATE test program implementation to optimize SoC power and TDP, working with platform and system engineers on correlation work needed for those optimizations.
Drive product manufacturing fuse requirements and end-to-end data flow for fusing across test sockets.
Lead projects, manage external vendors, drive cross-functional teams, and deliver sub-projects within larger development programs.
Develop and bring up ATE test methods and programs; perform characterization, debug, and yield analysis.
Take products from definition through launch.
Drive sample-delivery milestones and product development across the lifecycle, including quality and quantity.
Drive yield recovery definition and implementation, including redundancy and repair for logic, arrays, and analog, in partnership with cross-functional teams.