Principal Product Engineer

Microsoft • Redmond, WA

4d • $142,800 - $304,200

About The Position

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) powers Microsoft’s Intelligent Cloud mission by delivering foundational technologies and infrastructure for Microsoft’s online businesses and Azure platform. The Compute Silicon & Manufacturing Engineering (CSME) organization designs, develops, manufactures, and packages computer chips, including Azure Cobalt. Within it, the Silicon Manufacturing and Product Engineering (SMPE) team defines and delivers operational measures of success for hardware manufacturing, improving planning, quality, delivery, scale, and sustainability for Microsoft cloud hardware.

The Principal Product Engineer is responsible for product and test engineering for new product development and manufacturing, taking products from definition through launch. The role focuses on semiconductor IC development and manufacturing, fabrication, testing, and packaging. It drives pre-silicon readiness and post-silicon power and performance tuning, ATE test program implementation and optimization, manufacturing fuse requirements, and end-to-end fusing data flow. The engineer works with platform and system teams, external vendors, and cross-functional partners, and applies product engineering expertise to deliver successful hardware launches.

The role calls for project leadership, strong ATE test-program expertise, and knowledge of DFT, silicon fabrication, product qualification and reliability, and transistor theory. Relevant product markets include high-performance computing, AI, GPUs, and CPUs. The position requires Microsoft Cloud Background Check screening and eligibility for access to export-controlled information, which may require verification of citizenship or other qualifying status.

Requirements

• Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or a related field and 3+ years of technical engineering experience; or master’s degree in one of these fields and 6+ years of experience; or bachelor’s degree in one of these fields and 8+ years of experience; or equivalent experience.
• Experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.
• Strong project leadership skills, including managing external vendors and driving cross-functional teams and sub-projects.
• Excellent knowledge of ATE test-program development, including test-method development, test bring-up, characterization, debug, and yield analysis.
• Knowledge of DFT, silicon fabrication processes, product qualification and reliability (Q&R), and basic transistor theory.
• Ability to meet Microsoft, customer, and/or government security screening requirements, including passing the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter.
• Must provide proof of citizenship, U.S. residency, or other protected status as required to assess eligibility for access to export-controlled information; citizenship or status will be verified with applicable documentation.

Nice To Haves

• 8+ years of product development and manufacturing experience in large-scale and/or high-performance areas such as AI, machine learning, neural networks, CPUs, or high-power SoCs/chips.
• 8+ years of experience developing integrated circuits, including pre-silicon work, first-silicon bring-up, and new product introduction.
• 5+ years of product and test engineering experience, including ATE test-program development and debug; Advantest V93K experience is a plus.
• Excellent presentation and communication skills, including the ability to influence and communicate effectively with stakeholders at all levels.
• Experience leading cross-functional teams and understanding program or project management.
• Experience managing supply chains, vendors or partners, and integrated-circuit production.
• Experience gathering system and customer requirements and interfacing with stakeholders.
• Experience with silicon configuration (SKU) management and internal supplier/customer interfacing.
• Knowledge of end-to-end product development flow and driving sample-delivery milestones across the product lifecycle, including quality and quantity.
• Knowledge of power/performance modeling for ATE binning optimization in pre- and post-silicon phases, including ATE binning implementation and characterization data collection.
• Knowledge of yield-recovery definition, including redundancy and repair for logic, array, and analog, and implementation through test programs, test content, and SKUs.
• System and platform validation experience, including work across ATE, RVP, and customer boards for product validation and characterization.
• Experience with failure analysis, qualification, and yield analysis.

Responsibilities

• Perform product and test engineering for new product development and manufacturing.
• Drive pre-silicon readiness for power, performance, thermal, and power-delivery-related tests and features to support successful power-on bring-up.
• Drive power and performance tuning during the post-silicon phase in partnership with platform teams.
• Drive ATE test program implementation to optimize for SoC power/TDP and work with platform and system engineers on correlation work needed for optimization.
• Drive product manufacturing fuse requirements and end-to-end data flow for fusing across various test sockets.
• Manage external vendors, lead cross-functional teams, and drive sub-projects within larger development programs.
• Take products from definition through launch.
• Apply customer focus, adaptability, growth mindset, results orientation, influence, and sound judgment.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal