Principal Product Engineer

Microsoft•Redmond, WA

3d•$142,800 - $274,800

About The Position

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) powers Microsoft’s cloud infrastructure and supports its Intelligent Cloud mission. The Compute Silicon & Manufacturing Engineering (CSME) organization designs, develops, manufactures, and packages Microsoft computer chips, including Azure Cobalt. Within CSME, the Silicon Manufacturing and Product Engineering (SMPE) team helps define and deliver operational measures of success for hardware manufacturing, improving planning, quality, delivery, scale, and sustainability. The Principal Product Engineer is responsible for product and test engineering for new product development and manufacturing. The role requires experience in semiconductor integrated-circuit development, manufacturing, fabrication, testing, and packaging, and covers the product lifecycle from definition through launch. The engineer will lead readiness and optimization work for power, performance, thermal, and power-delivery features, and work with platform and system engineers, vendors, and cross-functional teams to deliver and improve products.

Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or a related field and 3+ years of technical engineering experience; or a master’s degree in one of these fields and 6+ years of experience; or a bachelor’s degree in one of these fields and 8+ years of experience; or equivalent experience.
Experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.
Excellent knowledge of ATE test-program development, including test-method development, test bring-up, characterization, debug, and yield analysis.
Knowledge of design for test (DFT), silicon fabrication processes, product quality and reliability, and basic transistor theory.
Strong project leadership skills, including managing external vendors and driving cross-functional teams and sub-projects.
Ability to meet Microsoft, customer, and/or government security screening requirements, including the Microsoft Cloud Background Check upon hire or transfer and every two years thereafter.
Ability to meet export-control access requirements; successful candidates must provide citizenship or qualifying residency/protected-status documentation, with citizenship verified using a valid passport where applicable.

Nice To Haves

8+ years of product development and manufacturing experience in large-scale and/or high-performance areas such as AI, machine learning, neural networks, CPUs, or high-power SoCs/chips.
8+ years of experience developing integrated circuits, including pre-silicon work, first-silicon bring-up, and new-product introduction.
5+ years of experience in product and test engineering, ATE test-program development, and debug; Advantest V93K experience is a plus.
Excellent presentation and communication skills, with the ability to influence, engage, and communicate effectively with stakeholders at all levels.
Experience leading cross-functional teams and understanding program or project management.
Experience managing supply chains, vendors or partners, and integrated-circuit production.
Experience gathering system and customer requirements and interfacing with stakeholders.
Experience with silicon configuration (SKU) management and internal supplier/customer interfacing.
Experience with end-to-end product development flow and driving sample-delivery milestones across the lifecycle, balancing quality and quantity.
Knowledge of power and performance modeling for ATE binning optimization in pre- and post-silicon phases.
In-depth understanding of ATE test-program power/performance binning implementation, including required characterization data collection.
Knowledge of yield-recovery definition, including redundancy and repair for logic, array, and analog, and implementation through test programs, test content, and SKU.
System and platform validation background.
Experience working across ATE, RVP, and customer-board platforms for product validation and characterization.
Experience with failure analysis, qualification, and yield analysis.

Responsibilities

Drive pre-silicon readiness for power, performance, thermal, and power-delivery-related tests and features to support successful power-on bring-up.
Drive power and performance tuning during the post-silicon phase in partnership with platform teams.
Drive ATE test-program implementation to optimize SoC power and TDP.
Work with platform and system engineers on correlation work that enables optimization.
Drive product-manufacturing fuse requirements and end-to-end data flow for fusing across test sockets.
Manage external vendors, lead cross-functional teams, and drive sub-projects within larger development programs.
Take products from definition through launch.
Drive end-to-end product development and sample-delivery milestones across the product lifecycle.
Partner with cross-functional teams on yield-recovery implementation, including test programs, test content, and SKU considerations.
Gather system and customer requirements and interface with relevant stakeholders.