Principal Product Engineer

Renesas Electronics•Palm Bay, FL

3d•Onsite

About The Position

Renesas Electronics is a global semiconductor company delivering innovative solutions across embedded processing, analog, power, connectivity, and system-on-chip technologies for automotive, industrial, infrastructure, and IoT markets. We are currently looking for a Principal Product Engineer to join our Hi-Reliability team in Palm Bay, Florida. In this role, you'll help bring advanced IC products from development through characterization, qualification, and production, working across engineering teams to solve complex product challenges and support semiconductor technologies designed for demanding space and high-reliability applications. As a Principal Product Engineer on our Hi-Reliability team in Palm Bay, Florida, you'll apply your semiconductor expertise to develop and deliver high-reliability ICs for space and harsh environments. Lead projects from development through NPI, characterization, qualification, manufacturing readiness, and production release. Collaborate with cross-disciplinary experts in design, test, reliability, packaging, radiation effects, and manufacturing to solve complex challenges, drive continuous improvement, and ensure the delivery of reliable, manufacturable semiconductor solutions.

Requirements

Bachelor's degree in Electrical Engineering.
10+ years of experience executing new product development within the semiconductor industry.
Strong semiconductor/IC experience.
Experience with Product Engineering and semiconductor new product introduction (NPI).
Experience with IC characterization and evaluation of product performance.
Strong data analysis capability, including interpretation of characterization, test, yield, production, or other semiconductor product data.
Strong problem-solving, communication, and cross-functional collaboration skills.

Nice To Haves

Radiation-hardened IC or radiation-effects experience.
Space, high-reliability, or harsh-environment semiconductor experience.
Familiarity with MIL-PRF-38535 or related high-reliability semiconductor standards.
Experience with semiconductor Automated Test Equipment (ATE).
Experience with ATE platforms such as Advantest V93K, Teradyne UltraFLEX/microFLEX, ETS-64, or similar systems.
Experience with bench testing, IC debug, silicon bring-up, or electrical validation.
Experience with bench-to-ATE correlation or production test correlation.
Experience using JMP, Spotfire, Python, or similar statistical/data-analysis tools.
Experience with analog, mixed-signal, power management, or other complex IC technologies.
Previous technical leadership, mentoring, or cross-functional technical ownership experience.
Master's degree in Electrical Engineering.

Responsibilities

Lead Product Engineering activities for new ICs from initial silicon through characterization, qualification, production readiness, and release.
Coordinate product engineering activities across IC design, test, applications, packaging, reliability, radiation effects, assembly, and manufacturing teams.
Plan and execute IC characterization to evaluate electrical performance and product requirements.
Analyze characterization, test, yield, and production data to identify trends, performance margins, risks, and improvement opportunities.
Use data-driven analysis to support product decisions and investigate performance, yield, quality, reliability, and manufacturability issues.
Partner with Test Engineering on characterization, production test strategy, ATE activities, correlation, and product readiness.
Support investigation and root-cause analysis of complex product and manufacturing issues.
Contribute to product specifications, qualification activities, test requirements, and release criteria.
Identify opportunities to improve NPI execution, characterization, data analysis, yield, and product release processes.
Communicate technical findings, risks, and recommendations across engineering teams and project stakeholders.