About The Position

We are seeking a Principal Mechanical Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact leadership role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale Rack deployments.

Requirements

  • B.S. or M.S. in Mechanical Engineering.
  • 12+ years in high-performance compute (HPC), AI hardware, or datacenter systems.
  • A proven track record of owning at least one full product lifecycle—from blank-page concept through High-Volume Manufacturing (HVM).
  • Expert-level understanding of metal fabrication (Milling, Casting, Sheet Metal) and how these processes impact thermal performance and structural integrity.
  • Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of "Drip-Free" connector integration.
  • Expert user of FEA tools for structural and vibration analysis.
  • Ability to drive technical alignment across silicon, power, and optical engineering teams.

Nice To Haves

  • Direct experience with AI/GPU-based architectures and ultra-high-density power delivery
  • Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
  • Experience with blind-mate liquid and power interfaces.

Responsibilities

  • Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
  • Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load Extraction Handles.
  • Define mechanical paths for ultra-high-density power delivery (Busbars) and complex cable management.
  • Review liquid cooling management by providing mechanical integration feedback on manifold distribution and QD/leak-mitigation system compatibility.
  • Contribute mechanical design inputs to balance hybrid air/liquid cooling solutions.
  • Drive thermal strategy for 1kW+ nodes using CFD to balance hybrid air/liquid cooling.
  • Optimize designs for high-volume manufacturing using Precision Milling, Die Casting, and Complex Sheet Metal fabrication.
  • Ensure system integrity against Transportation Shock & Vibration and extreme Thermal/Humidity cycling.
  • Implement Design for Cost (DfC) and Easy Assembly (DFA) to ensure seamless serviceability and global deployment.
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