Principal Mechanical Engineer - RF and Airborne Sensors

RTX•McKinney, TX

9d•$107,500 - $204,500•Onsite

About The Position

RTX is hiring a Principal Mechanical Engineer to provide technical leadership and develop packaging solutions for RF products. The role involves design and analysis of RF product packaging throughout the product life cycle, including use of 3D CAD and creation of Technical Data Packages using GD&T. The engineer will provide technical oversight and guidance to small work groups, serve as an organizational subject-matter expert, and lead development of common and mature RF product packaging solutions. This is an onsite role in McKinney, Texas. U.S. citizenship and an active, existing DoD Secret clearance after day one are required. Relocation may be available based on candidate eligibility. The listed salary range is $107,500–$204,500. Eligible hires may receive benefits and annual incentive compensation, subject to role and business-unit eligibility.

Requirements

Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM).
At least 7 years of prior relevant experience.
Experience designing and analyzing packaging for RF products, such as circuit card assemblies, antennas, radomes, RF test equipment, harnesses, and interconnects, throughout the product life cycle, including use of 3D CAD software.
Experience creating Technical Data Packages using GD&T.
U.S. citizenship and ability to obtain and maintain a U.S. government security clearance; an active and existing DoD Secret clearance is required after day one.

Nice To Haves

Master of Science in mechanical engineering or electrical engineering.
Experience serving as a Responsible Engineering Authority (REA), Control Account Manager (CAM), and/or Integrated Product Team Lead (IPTL).
Supplier management for built-to-print or build-to-specification RF products.
Experience creating and presenting professional-level design documentation to company leadership and program customers.
Experience with Creo Simulate or ANSYS Workbench for preliminary structural and thermal analysis of design concepts.
Excellent written and verbal communication skills.
Experience in failure investigation, root-cause identification, and corrective-action implementation.
Familiarity or direct experience with RF PCB material stack-ups and circuit card assembly layout.
Experience with one-dimensional tolerance analysis for complex mechanical assemblies.
Experience developing technical proposals, engineering project estimates, and/or white papers.
Experience with requirements-verification test planning and execution.

Responsibilities

Provide technical oversight and guidance to small work groups.
Lead the development of common and mature RF product packaging solutions.
Serve as a technical resource and subject-matter expert across the organization.
Perform design and analysis for RF product packaging throughout the product life cycle, including using 3D CAD.
Create Technical Data Packages using Geometric Dimensioning and Tolerancing (GD&T).