Principal High Speed Board Designer (TERADYNE, Agoura Hills, CA)

Teradyne•Agoura Hills, CA

8d•$197,800 - $316,400

About The Position

Teradyne’s Silicon Technology Engineering team is seeking an experienced Principal High-Speed Board Designer to lead the design and development of advanced prototype and system-characterization hardware for next-generation ASIC platforms. The role supports the company’s strategy to own the end-to-end signal path from ASIC and package through interconnect and instrument. The designer will develop characterization and validation platforms that accelerate silicon bring-up, validate signal integrity, and reduce system-integration risk before production hardware is available. This is not a traditional PCB design role. It involves close collaboration with ASIC designers, package engineers, signal-integrity engineers, system architects, and instrument-development teams to co-design the complete signal-delivery path. The position is based in Agoura Hills, California. The base salary range is $197,800–$316,400, with base salary dependent on experience and skill set and potentially varying with demand and location. The role is eligible for discretionary bonuses based on financial performance. Teradyne offers health and well-being programs and other benefits, including medical, dental, vision, flexible spending accounts, retirement savings plans, life and disability insurance, paid vacation and holidays, and tuition assistance.

Requirements

Bachelor’s or master’s degree in Electrical Engineering or a related field.
At least 8 years of experience designing high-performance digital and mixed-signal circuit boards.
Expertise in high-speed PCB design for data rates of 25 Gbps and above.
Hands-on lab experience with oscilloscopes, VNAs, TDR/TDT, BERTs, and high-speed measurement equipment.
Strong debugging and problem-solving skills.
Experience supporting ASIC silicon bring-up and characterization.
Experience working closely with semiconductor development teams from concept through production.
Understanding of manufacturing, DFM, DFT, and volume-production requirements.

Nice To Haves

Knowledge of advanced packaging technologies, chiplets, and heterogeneous integration.
Familiarity with electromagnetic simulation tools, including Ansys HFSS and Keysight ADS.
Experience with industry-standard EDA tools.
Experience with high-speed interfaces and protocols.

Responsibilities

Lead architecture, design, layout, and bring-up of high-speed characterization and prototype boards for custom ASIC programs.
Develop independent system-characterization platforms to validate ASIC performance ahead of instrument readiness.
Co-design the complete signal path, including ASIC package, PCB interconnect, connectors and cables, instrument interfaces, test fixtures, and sockets.
Partner with ASIC, package, signal-integrity, and system teams to optimize signal integrity, power integrity, timing, and overall system performance.
Perform channel analysis, loss budgeting, and design tradeoff studies for high-speed serial links.
Define measurement methodologies for silicon characterization, debugging, and performance correlation.
Drive board bring-up, debugging, and root-cause analysis of electrical and system-level issues.
Support prototype development through manufacturing, assembly, and lab validation.
Establish reusable board-design methodologies and best practices for future ASIC programs.