Principal Hardware Engineer

Teradyne•North Reading, MA

1d•$186,500 - $298,500

About The Position

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world! We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive. Our Purpose We deliver manufacturing automation across industries and applications around the world. As a leading supplier of automated test equipment, we enable semiconductor companies to ensure the performance, reliability, and quality of the devices that power today’s technology. Opportunity Overview We are seeking a Principal Hardware Engineer to join our DC Hardware team. In this role, you will design, develop, and validate high‑current, high‑power sourcing and switching hardware used in semiconductor automated test equipment (ATE). You will play a key role in advancing power delivery architecture, focusing on fast transient response, load regulation, protection systems, thermal management, and system‑level integration. This position provides the opportunity to own power‑delivery modules from concept through production release, supporting advanced SoCs, high‑power devices, and complex test conditions. You will collaborate closely with cross‑functional teams across hardware, firmware, mechanical, and test engineering to deliver robust, high‑performance solutions.

Requirements

Bachelor’s or Master’s degree in Electrical Engineering or related field
8+ years of experience in power electronics, high‑current power delivery, or instrumentation hardware design
Proven experience architecting and designing high‑current power delivery modules (mA to 100+ A)
Strong expertise in switching power supplies, multiphase regulators, linear regulators, and advanced power‑stage topologies
Experience designing fast‑response voltage/current sourcing circuits optimized for transient performance and dynamic load conditions
Deep understanding of power integrity and PDN optimization across full signal paths (instrumentation, cabling, loadboard, and DUT)
Experience modeling and mitigating droop, overshoot, ringing, and ground bounce under fast load conditions
Proficiency in simulation and analysis of loop stability, compensation networks, and transient response
Experience designing protection systems including OCP, OVP, OTP, short‑circuit protection, and fault isolation
Knowledge of reliability engineering, derating techniques, and thermal modeling for long‑term system stability
Experience with high‑current routing, low‑impedance path design, and system‑level thermal considerations
Proven ability to lead hardware bring‑up, debug complex analog/mixed‑signal systems, and drive root‑cause analysis
Hands‑on experience with lab equipment including oscilloscopes, power analyzers, current probes, and electronic loads
Proficiency with SPICE simulation, PDN modeling tools, and PCB design tools
Experience collaborating with firmware teams on control loops, telemetry, calibration, and system integration
Strong analytical, problem‑solving, and communication skills

Nice To Haves

Experience designing power‑delivery modules specifically for semiconductor ATE systems
Knowledge of dynamic voltage scaling, digital power control, and telemetry systems
Familiarity with high‑current connectors, cabling, and low‑impedance mechanical design principles
Experience with thermal modeling, heatsink design, and airflow optimization
Understanding of HALT/HASS, stress testing, and failure‑mode analysis
Track record of contributing to design standards, best practices, or technical mentorship

Responsibilities

Design, develop, and validate high‑current, high‑power sourcing and switching hardware used in semiconductor automated test equipment (ATE).
Advance power delivery architecture, focusing on fast transient response, load regulation, protection systems, thermal management, and system‑level integration.
Own power‑delivery modules from concept through production release, supporting advanced SoCs, high‑power devices, and complex test conditions.
Collaborate closely with cross‑functional teams across hardware, firmware, mechanical, and test engineering to deliver robust, high‑performance solutions.
Lead hardware bring‑up, debug complex analog/mixed‑signal systems, and drive root‑cause analysis.
Support system‑level integration including loadboards, probecards, and DUT environments.