Hardware Engineer, Principal

MACOM•Newport Beach, CA

13h

About The Position

The Hardware Engineer, Principal designs, develops, and documents complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs. This role involves identifying techniques and methodologies for modeling and measurement of devices and systems and actively participating in their evaluations. The interconnect solution may comprise multiple boards. The Hardware Engineer, Principal drives feasibility analyses at the onset of the PCB (printed circuit board) definition phase, evaluates and specifies electrical characteristics and performance of the PCB to determine compliance with appropriate regulating standards, and takes cradle-to-grave ownership of the PCB according to requirements. This role collects inputs from users of the PCB, including but not limited to, validation engineers, product engineers, IC design engineers, and signal integrity engineers. The engineer will draft a BRD (Board Required Document) / Block Diagram to clearly define expectations for the board and review it. They will consult with designers and application engineers for component selection and circuit design around the device under test, and design complex circuits as required. The role involves capturing schematics using EDA tools such as xDxDesigner, creating electrical symbols and layout footprints for new components, and creating Bills of Material (BOM). Maintaining the CAD library and creating board layouts using EDA tools such as Siemens PADS are also key responsibilities. The engineer will interact with external vendors as necessary, perform Power Integrity analysis of assigned boards using PI Analysis tools such as HyperLynx Power Integrity, and perform Signal Integrity simulations and analysis of assigned boards using tools such as Ansys SiWave or HFSS. Collaboration with PCB layout engineers to optimize routing for high-speed signals, development and validation of models for transmission lines, connectors, vias, and IC packages, and conducting pre- and post-layout SI analysis to ensure compliance with design specifications are crucial. The role includes supporting design reviews and providing recommendations for signal integrity improvements, working closely with cross-functional teams including electrical, mechanical, and firmware engineers, and performing lab measurements using oscilloscopes, VNAs, and TDRs to correlate with simulation results. Documenting analysis results and presenting findings to engineering leadership, creating documentation for PCB fabrication, and working with PCB vendors to resolve issues during manufacturing are also part of the role. Preparing Bonding Diagrams for high-speed Optical interfaces and Chip on Board devices, creating high-speed board design rules for automation and to speed up layout design time and effort, organizing and driving board design reviews for assigned projects, and driving PCB verification and debug (board bring-up) covering both board functionality and performance are key tasks. This position also involves providing mentorship to junior members of the team.

Requirements

PhD with 4 or more years of experience or MSEE with 6 or more years of experience or BSEE with 8 or more years of experience.
6 or more years of experience/knowledge in schematic capture, PCB Design and layout using CAD tools such as xDxDesigner, PADS, HyperLynx, Siwave and HFSS.
Strong understanding of transmission line theory, impedance control, crosstalk, and jitter.
Proficiency in SI simulation tools and lab equipment.
Experience with high-speed interfaces such as PCIe, DDR, USB, Ethernet, etc.
Extensive knowledge on Board Design for manufacturing (DFM), PCB Fab Process.
Extensive experience with lab equipment including VNAs, BERTs.
Excellent problem-solving and communication skills.

Nice To Haves

Experience with CAD Library creation/maintenance is a plus.
Knowledge on firmware development and microcontrollers is a plus.

Responsibilities

Designs, develops, and documents complex interconnect solutions for internal hardware needs and customer hardware reference designs.
Identifies techniques and methodologies for modeling and measurement of devices and systems and actively participates in their evaluations.
Drives feasibility analyses at the onset of the PCB definition phase.
Evaluates and specifies electrical characteristics and performance of the PCB to determine compliance to appropriate regulating standards.
Takes cradle-to-grave ownership of PCB according to requirements.
Collects inputs from users of the PCB, including validation engineer, product engineer, IC design engineer, signal integrity engineer etc.
Drafts a BRD (Board Required Document) / Block Diagram to clearly define what is expected of the board & reviews it.
Consults with designers, application engineers for component selection and circuit around the device under test.
Designs complex circuits as required.
Captures schematic using EDA tool such as xDxDesigner.
Creates electrical symbols and layout footprints for new components.
Creates Bill of Material (BOM).
Maintains CAD library.
Creates layout of the board using EDA tools such as Siemens PADS.
Interacts with external vendors as necessary.
Performs Power Integrity of assigned boards using PI Analysis tools such as HyperLynx Power Integrity.
Perform Signal Integrity simulations and analysis of assigned boards using tools such as Ansys SiWave or HFSS.
Collaborates with PCB layout engineers to optimize routing for high-speed signals.
Develops and validates models for transmission lines, connectors, vias, and IC packages.
Conducts pre- and post-layout SI analysis to ensure compliance with design specifications.
Supports design reviews and provides recommendations for signal integrity improvements.
Works closely with cross-functional teams including electrical, mechanical, and firmware engineers.
Performs lab measurements using oscilloscopes, VNAs, and TDRs to correlate with simulation results.
Documents analysis results and presents findings to engineering leadership.
Creates documentation for PCB fabrication and works with PCB vendors to resolve issues during manufacturing.
Prepares Bonding Diagram for high-speed Optical interface and Chip on Board devices.
Creates high-speed board design rules for automation and to speed up the Layout design time and effort.
Organizes and drives board design reviews for assigned projects.
Drives PCB verification and debug (board bring-up) covering both board functionality and performance.
Provides mentorship to junior members of the team.