Principal Hardware Engineer (CRM)

Medtronic•Tempe, AZ
•Onsite

About The Position

The Principal Engineer (ICPE) provides technical leadership and product engineering ownership for custom integrated circuits throughout product development and through transfer to production. The role defines and drives fabrication, wafer-test, characterization, qualification, and reliability requirements; conducts statistical yield and risk analyses; performs electrostatic discharge (ESD) evaluations and wafer-level experiments; manages development wafer inventory and build requirements; and leads complex technical problem-solving. The position works closely with integrated circuit design, test engineering, operations, quality, reliability, and wafer fabrication suppliers to resolve technical issues. It interfaces with fabrication vendors on integrated circuit fractures, wafer-level Design of Experiments (DOE), and other technical matters. Key outcomes include a clean production handoff, robust test solutions, demonstrated product reliability, documented technical knowledge, and stable wafer-test yields. The Principal ICPE also establishes standard work and improves development processes using DOE and statistical analysis. The role is onsite a minimum of five days per week. Medtronic describes its CRM portfolio as therapies for pacing, defibrillation, and remote monitoring that restore, support, and protect heartbeats.

Requirements

  • Bachelor's degree and at least 7 years of relevant experience, or a master's degree and at least 5 years of relevant experience, or a Ph.D. and at least 3 years of relevant experience.
  • For baccalaureate degrees earned outside the United States, a degree satisfying the requirements of 8 C.F.R. § 214.2(h)(4)(iii)(A) is required.

Nice To Haves

  • Experience in custom integrated circuit product engineering.
  • Experience with semiconductor fabrication, wafer test, characterization, qualification, or reliability.
  • Experience with statistical yield analysis and DOE.
  • Experience with ESD evaluation or wafer-level experimentation.
  • Experience working with wafer fabrication suppliers and cross-functional engineering teams.

Responsibilities

  • Conduct research, design, development, and testing of electrical or mechanical hardware, including computer chips, circuit boards, and mechanical and electrical components.
  • Ensure hardware reliability, develop technical specifications for production, analyze hardware configuration and processing solutions, and test hardware conformance to specifications; design new products or modify existing products as needed.
  • Lead product engineering activities for custom integrated circuits from development through production transfer.
  • Define and drive fabrication, wafer-test, characterization, qualification, and reliability requirements.
  • Analyze statistical yield data, technical risk, and reliability performance to identify and mitigate product issues.
  • Plan and execute ESD evaluations, wafer-level experiments, and DOE.
  • Partner with integrated circuit design, test engineering, operations, quality, reliability, and wafer fabrication suppliers to resolve complex technical issues.
  • Manage development wafer inventory, build requirements, and wafer-level engineering activities.
  • Deliver robust test solutions, stable wafer-test yields, demonstrated product reliability, and documented technical knowledge for production handoff.
  • Establish standard work and improve product-development processes using DOE and statistical analysis.

Benefits

  • Competitive salary and flexible benefits package.
  • Short-term incentive through the Medtronic Incentive Plan (MIP).
  • For regular employees working 20 or more hours per week: health, dental, and vision insurance; Health Savings Account; healthcare Flexible Spending Account; life insurance; long-term disability leave; dependent daycare spending account; tuition assistance or reimbursement; and the Simple Steps global well-being program.
  • For all regular employees: incentive plans; 401(k) plan with employer contribution and match; short-term disability; paid time off; paid holidays; Employee Stock Purchase Plan; Employee Assistance Program; Non-qualified Retirement Plan Supplement subject to IRS earning minimums; and Capital Accumulation Plan available to Vice Presidents and above or subject to IRS earning minimums.
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