Principal Failure Analysis Engineer (Semiconductor / Electronics)

Eurofins•Irvine, CA

3d•$120,000 - $160,000•Onsite

About The Position

Eurofins EAG Laboratories is seeking a Principal Failure Analysis Engineer with over 40 years of experience in engineering and materials testing services. As part of Eurofins Scientific, a global leader in scientific services, EAG supports various industries including semiconductors, electronics, pharmaceuticals, medical devices, energy systems, and consumer products. This role involves using advanced analytical chemistry, microscopy, surface analysis, and engineering sciences to solve complex client challenges across the product lifecycle. The company values curiosity, precision, and impact, offering a dynamic environment where employees' work directly influences the safety, reliability, and performance of global products. The laboratory in Irvine, CA, serves clients from startups to Fortune 500 companies, providing test, engineering, and reliability services. The failure analysis staff operate in an innovative environment, supporting clients in research, development, and refinement of technologies for consumer electronics, medical devices, automotive, military, aerospace, and manufacturing industries. The role emphasizes a hands-on approach, utilizing leading-edge methods and tools to gain insights that fuel engineering. The ideal candidate enjoys technology, problem-solving, teamwork, and technical challenges.

Requirements

BSEE or MSEE required.
Minimum 15+ years of direct, hands-on Failure Analysis laboratory experience in the semiconductor and electronics industry.
Experience and knowledge in Semiconductor, materials analysis, electronics manufacturing, design, etc.
Required Hands-on experience/expertise in Root cause failure analysis.
Required Hands-on experience/expertise in Fault isolation techniques: OBIRCH, XIVA, emmi, IR Thermography.
Required Hands-on experience/expertise in Electrical Test/Measurements: ATE datalog, Curve trace, Bench test (parametric analyzer, o-scopes, CV measurement, LCR meter, etc.).
Required Hands-on experience/expertise in Microprobing/Picoprobing.
Required Hands-on experience/expertise in X-ray (2D).
Required Hands-on experience/expertise in SEM/EDS.
Working knowledge of Device physics, circuits/schematics, analog/digital circuits, IC design.
Working knowledge of DPA, Mil-Std, AEC, JEDEC, IPC, etc.
Working knowledge of Semiconductor fabrication/process, yield enhancement.
Working knowledge of Manufacturing, IC package assembly.
Working knowledge of NPI, Reliability/Qualification testing.
Excellent English communication skills (written and spoken).
A strong work ethic with a commitment to accuracy.
The ability to work to deadlines in a team-oriented environment are essential.
Must be able to remain in a stationary position up to 80% of the time.
Ability to continuously operate a personal computer or lab equipment for extended periods of time (4 or more hours).
Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead.
Ability to communicate clearly and understandably ensure an accurate exchange of information in normal conversational distance, over the telephone, and in a group setting.
Ability to handle small and fragile devices with tweezers and /or fingers.
Require close distance visual acuity with or without correction (Glasses, Contacts, etc.).
Must be willing and able to wear PPE such as hard-hat, steel-toed shoes, safety glasses, laboratory coat and/or any other devices or equipment that is required.
Learn new tasks, remember processes, maintain focus, complete tasks independently, make timely decisions in the context of a workflow, ability to communicate with visitors, ability to complete tasks in situations that have a speed or productivity quota.
Ability to move equipment or items up to 50 lbs.
Must be a U.S. Person as defined by ITAR (U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee).

Nice To Haves

Experiences as a technical lead, manager or mentor are highly desired.
Highly desired Hands-on experience/expertise in LVP/LTP, SDL/LADA.
Highly desired Hands-on experience/expertise in DBFIB, PFIB.
Highly desired Hands-on experience/expertise in X-ray (CT/3D).
Highly desired Hands-on experience/expertise in Scanning Acoustic Microscopy (C-SAM).
Highly desired Hands-on experience/expertise in Deprocessing (RIE, parallel lapping, PFIB, etc.).
Highly desired Hands-on experience/expertise in Chemical etching (decapsulation, HF, acids/bases, delineation, etc.).
Highly desired Hands-on experience/expertise in Plasma etching (RIE, ICP, CF4, etc.).
Highly desired Hands-on experience/expertise in Cross sectioning (metallurgical, ion mill, DB FIB, etc.).
Highly desired Hands-on experience/expertise in Nanoprobing.
Highly desired Hands-on experience/expertise in FinFET and advanced node technology.
Highly desired Hands-on experience/expertise in DPA (Destructive Physical Analysis).
Highly desired Software: GDS layout, LabView.