Failure Analysis Engineer (Semiconductor / Electronics)

Eurofins•Irvine, CA

3d•$80,000 - $140,000•Onsite

About The Position

Eurofins EAG Laboratories is seeking a Failure Analysis Engineer with expertise in the semiconductor and electronics industry. This role involves utilizing advanced tools and techniques to conduct technical discussions, design and execute analytical plans, interpret results, and recommend next steps for clients. As a senior member of the team, you will collaborate with and potentially lead other engineers, manage projects, plan work, and solve complex multi-disciplinary client issues. The position offers exposure to a dynamic range of samples, tools, and techniques in an innovative environment. The ideal candidate is excited by challenging cases, comfortable in a fast-paced setting, and thrives in a team-centric problem-solving approach.

Requirements

BSEE is required.
Direct, hands-on Failure Analysis laboratory experience (semiconductor and electronics industry).
Experience and knowledge in Semiconductor, materials analysis, electronics manufacturing, design, etc.
Required Hands-on experience/expertise: Root cause failure analysis, Fault isolation techniques (OBIRCH, XIVA, emmi, IR Thermography), Electrical Test/Measurements (ATE datalog, Curve trace, Bench test - parametric analyzer, o-scopes, CV measurement, LCR meter, etc.), Microprobing/Picoprobing, X-ray (2D), SEM/EDS.
Working knowledge of: Device physics, circuits/schematics, analog/digital circuits, IC design, Semiconductor fabrication/process, yield enhancement, Manufacturing, IC package assembly, NPI, Reliability/Qualification testing.
Excellent English communication skills (written and spoken).
A strong work ethic with a commitment to accuracy.
The ability to work to deadlines in a team-oriented environment are essential.
Must be able to remain in a stationary position up to 80% of the time.
Ability to continuously operate a personal computer or lab equipment for extended periods of time (4 or more hours).
Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead.
Ability to communicate clearly and understandably ensure an accurate exchange of information in normal conversational distance, over the telephone, and in a group setting.
Ability to handle small and fragile devices with tweezers and /or fingers.
Require close distance visual acuity with or without correction (Glasses, Contacts, etc.).
Must be willing and able to wear PPE such as hard-hat, steel-toed shoes, safety glasses, laboratory coat and/or any other devices or equipment that is required.
Learn new tasks, remember processes, maintain focus, complete tasks independently, make timely decisions in the context of a workflow, ability to communicate with visitors, ability to complete tasks in situations that have a speed or productivity quota.
Ability to move equipment or items up to 50 lbs.

Nice To Haves

Experiences as a technical lead, manager or mentor are highly desired.
Highly desired Hands-on experience/expertise: LVP/LTP, SDL/LADA, DBFIB, PFIB, X-ray (CT/3D), Scanning Acoustic Microscopy (C-SAM), Deprocessing (RIE, parallel lapping, PFIB, etc.), Chemical etching (decapsulation, HF, acids/bases, delineation, etc.), Plasma etching (RIE, ICP, CF4, etc.), Cross sectioning (metallurgical, ion mill, DB FIB, etc.), Nanoprobing, FinFET and advanced node technology, DPA (Destructive Physical Analysis).
Software: GDS layout, LabView.
Working knowledge of: DPA, Mil-Std, AEC, JEDEC, IPC, etc.

Responsibilities

Conduct technical discussions to understand client scope and expectations.
Design and execute appropriate analytical plans/methods.
Consult with clients, providing value-added insight and result interpretation.
Recommend suitable next steps for clients.
Work alongside peers and/or lead teams of engineers in the lab.
Manage projects and plan job tasks.
Engage in multi-disciplinary problem solving for complex client issues and requests.
Develop new methods or techniques.