Failure Analysis Engineer (Semiconductor / Electronics)

Eurofins USA Material Sciences•Irvine, CA

2d•Onsite

About The Position

Our laboratory in Irvine, CA, provides test, engineering, and reliability services to a broad spectrum of technology-based sectors. We are proud to support our clients who range from startup stages to Fortune 500 global industry leaders. Our failure analysis staff succeed within a challenging but inspiring world of innovation; helping to support our clients research, develop, understand, and refine technologies that shape consumer electronics, medical device, automotive, military, aerospace, and manufacturing industries, just to mention a few. We demonstrate a hands-on approach to technical expertise by utilizing leading-edge methods and tools to attain insight that fuel engineering. If you enjoy being immersed in technology, dreaming about the future, tackling challenges head-on, problem-solving through teamwork, flexing your technical abilities and taking pride in accomplishments, then join us to live this every day. In this role, you will employ a variety of advanced tools and techniques to help support diverse aspects of a client’s needs, which includes conducting technical discussions to understand the scope and expectations, designing and executing appropriate analytical plan/method, consulting with value-added insight and result interpretation, and recommending suitable next steps. As a senior member of the team, you will be responsible working alongside your peers and/or leading teams of engineers in the lab. The role will include aspects of project management, job planning, multi-disciplinary problem solving, legal projects and other complex client issues and requests. This is a dynamic role where you will be exposed to an ever-changing and evolving array of samples, tools and techniques on the path of innovation. If this role and the types of cases excite you, and you welcome daily challenges and are comfortable working in a fast-paced environment with a team-centric approach to solving problems, we encourage you to apply.

Requirements

BSEE is required.
Direct, hands-on Failure Analysis laboratory experience (semiconductor and electronics industry).
Experience and knowledge in semiconductor, materials analysis, electronics manufacturing, design, etc.
Employees are expected to comply with ISO 27001 standard and company requirements for Information security.
Must be a U.S. Person as defined by ITAR (U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee).
Hands-on experience/expertise in Root cause failure analysis.
Hands-on experience/expertise in Fault isolation techniques: OBIRCH, XIVA, emmi, IR Thermography.
Hands-on experience/expertise in Electrical Test/Measurements: ATE datalog, Curve trace, Bench test (parametric analyzer, o-scopes, CV measurement, LCR meter, etc.).
Hands-on experience/expertise in Microprobing/Picoprobing.
Hands-on experience/expertise in X-ray (2D).
Hands-on experience/expertise in SEM/EDS.
Excellent English communication skills (written and spoken).
A strong work ethic with a commitment to accuracy.
The ability to work to deadlines in a team-oriented environment are essential.
Must be able to remain in a stationary position up to 80% of the time.
Ability to continuously operate a personal computer or lab equipment for extended periods of time (4 or more hours).
Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead.
Ability to communicate clearly and understandably ensure an accurate exchange of information in normal conversational distance, over the telephone, and in a group setting.
Ability to handle small and fragile devices with tweezers and /or fingers.
Require close distance visual acuity with or without correction (Glasses, Contacts, etc.).
Must be willing and able to wear PPE such as hard-hat, steel-toed shoes, safety glasses, laboratory coat and/or any other devices or equipment that is required.
Learn new tasks, remember processes, maintain focus, complete tasks independently, make timely decisions in the context of a workflow, ability to communicate with visitors, ability to complete tasks in situations that have a speed or productivity quota.
Ability to move equipment or items up to 50 lbs.

Nice To Haves

Experiences as a technical lead, manager or mentor are highly desired.
Hands-on experience/expertise in LVP/LTP, SDL/LADA.
Hands-on experience/expertise in DBFIB, PFIB.
Hands-on experience/expertise in X-ray (CT/3D).
Hands-on experience/expertise in Scanning Acoustic Microscopy (C-SAM).
Hands-on experience/expertise in Deprocessing (RIE, parallel lapping, PFIB, etc.).
Hands-on experience/expertise in Chemical etching (decapsulation, HF, acids/bases, delineation, etc.).
Hands-on experience/expertise in Plasma etching (RIE, ICP, CF4, etc.).
Hands-on experience/expertise in Cross sectioning (metallurgical, ion mill, DB FIB, etc.).
Hands-on experience/expertise in Nanoprobing.
Hands-on experience/expertise in FinFET and advanced node technology.
Hands-on experience/expertise in DPA (Destructive Physical Analysis).
Software: GDS layout, LabView.
Working knowledge of Device physics, circuits/schematics, analog/digital circuits, IC design.
Working knowledge of DPA, Mil-Std, AEC, JEDEC, IPC, etc.
Working knowledge of Semiconductor fabrication/process, yield enhancement.
Working knowledge of Manufacturing, IC package assembly.
Working knowledge of NPI, Reliability/Qualification testing.
Able to develop new methods or techniques.