About The Position

KLA’s SPTS division develops advanced wafer-processing solutions, including etch, deposition, and vapor-based technologies, for applications ranging from research and development to high-volume production. The Principal Engineer will provide technical leadership in PVD and semiconductor process development, advancing next-generation equipment, chamber, and process capabilities. The role sets technical direction across PVD, metallization, annealing, thin films, and device integration, translating future device needs into equipment and technology roadmaps and leading complex programs across engineering teams and strategic suppliers. The engineer leads development from early technology evaluation through equipment and process qualification and implementation. This includes defining requirements, technical priorities, schedules, and risks; developing equipment and process capabilities; evaluating materials and characterization results; and communicating progress and recommendations to engineering leadership and partners. The role is based in Milpitas, California, and involves approximately 20% domestic and international travel.

Requirements

  • M.S. or Ph.D. in Chemical Engineering, Electrical Engineering, Physics, Materials Science, or a related semiconductor discipline.
  • 15+ years of semiconductor experience in PVD, thin-film deposition, metallization, process equipment, or related technology development.
  • Deep technical knowledge of PVD deposition processes and equipment.
  • Experience contributing to the development, modification, or introduction of PVD equipment, process chambers, or chamber hardware.
  • Strong understanding of semiconductor device integration and fabrication, including processes before and after metallization.
  • Experience with device metallization and annealing, and understanding of their relationship to device performance.
  • Experience leading complex technical development projects involving process, equipment, hardware, materials, and device requirements.
  • Experience evaluating or introducing new deposition materials and material stacks for advanced device applications.
  • Knowledge of materials and device characterization and ability to use characterization results to guide technical development.
  • Demonstrated experience collaborating with semiconductor equipment manufacturers and component suppliers.
  • Strong technical leadership, project management, communication, and cross-functional collaboration skills.

Nice To Haves

  • Experience developing or modifying PVD chambers, sources, or other deposition-system hardware.
  • Experience taking new equipment or process capabilities from concept and development through qualification and manufacturing implementation.
  • Knowledge of CVD and other thin-film deposition technologies.
  • Experience working with global equipment and component suppliers.

Responsibilities

  • Lead technical projects to develop new PVD equipment, chambers, hardware, and process capabilities for future semiconductor devices.
  • Define project requirements, technical breakthroughs, development priorities, schedules, and risks.
  • Partner with process and hardware engineering teams to develop and optimize PVD chamber and equipment capabilities.
  • Translate future device, metallization, and material requirements into equipment, chamber, hardware, and process requirements.
  • Apply device-integration knowledge to understand relationships among pre-metallization processes, PVD deposition, metallization, annealing, and downstream processing.
  • Drive evaluation and introduction of new materials and metallization approaches for future device technologies.
  • Coordinate technical development across process engineering, hardware engineering, materials, device integration, characterization, manufacturing, and supplier teams.
  • Collaborate with equipment manufacturers and component suppliers on chamber technologies, hardware designs, components, and process capabilities.
  • Review process, material, and device-characterization results to identify technical gaps and guide development priorities.
  • Identify technical and program risks and lead cross-functional teams toward resolution.
  • Lead development from early technology evaluation through equipment and process qualification and implementation.
  • Communicate technical progress, risks, tradeoffs, and recommendations to engineering leadership and key partners.

Benefits

  • Medical, dental, vision, life, and other voluntary benefits
  • 401(k) with company matching
  • Employee stock purchase program (ESPP)
  • Student debt assistance
  • Tuition reimbursement program
  • Development and career growth opportunities and programs
  • Financial planning benefits
  • Wellness benefits, including an employee assistance program (EAP)
  • Paid time off and paid company holidays
  • Family care and bonding leave
  • Performance incentive programs may be available
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