Principal Electrical Engineer

BAE Systems•Dallas, TX
•$107,359 - $182,510

About The Position

BAE Systems is seeking a mid-career Electrical Engineer to support its Dallas engineering team. The role is part of the Hardware Team, developing rugged commercial products and fully military-compliant products. The engineer will work within a small, collaborative, multidisciplinary engineering team and draw on resources across BAE Systems.

Requirements

  • Bachelor’s degree in electrical engineering.
  • At least four years of relevant industry experience, such as defense or electronics, or at least two years of relevant experience with a master’s degree.
  • Solid understanding of digital, analog, power, and mixed-signal electronics fundamentals and interface/communication standards such as UART, SPI, QSPI, I2C, USB, Ethernet, ARINC 429, MIL-STD-1553, and PCIe.
  • Experience with the SOSA standard for 3U and 6U VPX module design.
  • PCB/CCA design experience for 3U or 6U VPX and other form factors.
  • Proficiency testing and troubleshooting analog, digital, and power supply-based circuits in a laboratory setting using oscilloscopes, bench supplies, vector network analyzers, spectrum analyzers, frequency counters, arbitrary waveform generators, function generators, and logic analyzers.

Nice To Haves

  • Master’s degree in electrical engineering, RF engineering, or equivalent.
  • Familiarity designing with FPGAs, System-On-Chips (SoCs), and/or CPLDs using VHDL and/or Verilog.
  • Familiarity designing and writing embedded software for microcontroller-based systems and modules.
  • Knowledge of system-level EMI mitigation techniques and appropriate grounding and shielding architecture.
  • Experience with high-speed mixed-signal HDI PCB design, constraints management, and routing for interfaces with lane rates up to 25 Gbps.
  • Understanding of SPICE simulators and simulation methods, preferably LTSpice, TINA, or PSpice.
  • Experience with PCB and CCA design features including micro-vias and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, back drilling, high-pin-count/fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types.
  • Familiarity with Signal Integrity and Power Integrity as applied to proper layout techniques.
  • Ability to obtain a DoD Secret security clearance.

Responsibilities

  • Translate system requirements into system architectures and complex printed board assembly designs.
  • Create board schematics and layouts using Cadence Allegro System Capture.
  • Perform trade studies and prototyping to select critical components, develop optimized electronic architectural solutions (SWAP), and verify complex custom circuit blocks within an overarching system.
  • Document design verification tests and design review materials.
  • Participate in knowledge sharing and mentor others.
  • Work within schedule and budget constraints and raise concerns when challenges arise.

Benefits

  • Health, dental, and vision insurance for regular employees scheduled to work 20 or more hours per week.
  • Health savings accounts.
  • 401(k) savings plan.
  • Disability coverage.
  • Life and accident insurance.
  • Employee assistance program.
  • Legal plan.
  • Discounts on home, auto, and pet insurance.
  • Paid time off and paid holidays.
  • Paid parental, military, and bereavement leave, as well as applicable federal and state sick leave.
  • Company recognition program with monetary or non-monetary awards.
  • Other incentives may be available depending on position level and job specifics.
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