Principal DFT Engineer, HBM

Micron Technology • Folsom, CA

22h • $146,000 - $309,000

About The Position

As a Principal SoC DFT Engineer within the Heterogeneous Integration Group (HIG), you will be responsible for the DFT architecture, implementation, and signoff of complex HBM base-die System-on-Chip (SoC) designs. This role is part of the SoC execution team, working closely with RTL design, verification, physical design, and product engineering to ensure robust, scalable, and manufacturable test solutions from pre-silicon development through tapeout and product bring-up.

Requirements

• Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, or related field.
• 7+ years of relevant experience in SoC design, DFT, or implementation for complex digital ASICs or SoCs.
• Experience with scan insertion, MBIST/LBIST architectures, JTAG/boundary scan, and ATPG concepts.
• Familiarity with full RTL-to-GDS SoC flows, including interaction between DFT, synthesis, STA, and physical design.
• Experience working with large, complex SoCs involving multiple IPs and subsystems.
• Proficiency with industry-standard EDA tools from Siemens, Synopsys, and/or Cadence for DFT and implementation.
• Familiarity with scripting languages (Python, Tcl, Perl, etc.) for flow automation.

Responsibilities

• Own SoC-level DFT implementation, including scan, MBIST, LBIST (as applicable), boundary scan (JTAG), and test access architectures for HBM base-die designs.
• Drive DFT architecture definition early in the design cycle, ensuring alignment with SoC integration, floor planning, timing, power, and physical design constraints.
• Implement and integrate DFT logic at the block, subsystem, and full-chip levels, working closely with RTL and integration teams.
• Own DFT flow execution and signoff, including lint, CDC, DFT rule checks, ATPG readiness, and coverage closure.
• Collaborate with physical design teams to ensure DFT solutions are optimized for placement, routing, timing closure, and DRC/LVS signoff.
• Work closely with verification, product engineering, test, probe, and manufacturing teams to ensure testability, diagnosability, and smooth silicon bring-up.
• Support pre-silicon debug of DFT-related issues and assist with post-silicon bring-up and yield/debug analysis.
• Partner with CAD and methodology teams to define, improve, and standardize DFT flows across HBM SoC programs.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Principal