Precision Electromechanical Assembler 2 - Substrate Attach (2nd shift)

Northrop Grumman•Rolling Meadows, IL

10d•$45,100 - $75,100•Onsite

About The Position

Northrop Grumman Mission Systems is looking for you to join our Microelectronics Team as a Precision Electromechanical Assembler 2 (2nd shift) in our Sub-Attach Workcenter for Second Shift based out of Rolling Meadows, IL. This role involves performing a variety of operations to assemble, solder, and integrate precision electromechanical products, working from strict adherence to Northrop Grumman's Electronic Work Instructions (EWI's), detailed mechanical drawings, and verbal instructions. The position requires applying ESD practices and cleanroom procedures, accurate documentation, supporting equipment setup and maintenance, and following safety protocols for hazardous chemicals. Key tasks include die/substrate preparation, handling and dispensing die-attach materials, performing die attach operations using vision alignment, controlling process parameters, ensuring placement accuracy, monitoring coverage, performing in-process inspections, detecting and troubleshooting defects, supporting rework, and coordinating with engineering and quality teams. The role also involves using precision measuring instruments, assembling/disassembling/repairing precision assemblies, completing in-house certifications, and using Microsoft Office and Enterprise Resource Planning (ERP) software like SAP.

Requirements

High School diploma, or equivalent, and a minimum of 2 years of relevant work experience.
Ability to obtain and maintain a US Government Secret clearance
U.S. Citizenship Required
Basic computer skills
Strong attention to detail and excellent manual dexterity.
Must be comfortable working with some hazardous chemicals and cleaning solutions.
Must demonstrate strict and rigorous adherence to Northrop Grumman's safety protocols.
Must work well in a team environment and with other people.

Nice To Haves

Experience performing the assembly of the products using precision electromechanical techniques, specialized handheld tools used to handle very small items with good dexterity.
Experience working with and using a microscope.
Experience in a cleanroom environment.
Experience in soldering by specified workmanship standards.
Experience working with Enterprise Resource Planning (ERP) systems such as SAP.
Experience with shop safety practices and procedures during assembly operations.
Experience using measuring tools such as caliper, micrometer, and height gauge.
Experience reading technical blueprints /detailed electrical drawings / wiring diagrams.

Responsibilities

Perform a variety of operations to assemble / solder / integrate precision electromechanical products working from strict adherence to Northrop Grumman's Electronic Work Instructions (EWI's), detailed mechanical drawings, and verbal instructions.
Apply Northrop Grumman ESD practices and follow cleanroom/handling procedures to prevent contamination, corrosion, or surface damage that can cause poor adhesion.
Complete work instructions and records accurately (equipment ID, program/recipe, operator, lot numbers, run parameters, yields/scrap counts).
Support setup/Preventative Maintenance (PM) activities for die attach equipment; keep nozzles/dispense tools and fixtures clean; report tool alarms or drift.
Follow Northrop Grumman's EH&S chemical handling/Safety Data Sheet (SDS) requirements, Personal Protective Equipment (PPE), and safety procedures; ensure proper waste handling and storage of attach materials.
Clean and stage dies and substrates; confirm part numbers, lot traceability, die orientation, and die placement references.
Dispense and manage die-attach materials (adhesives/epoxies/solders as applicable) using approved recipes for dispense volume, bead geometry, and mix/usage rules.
Place dies accurately onto substrates/packages using vision alignment/tooling; perform the required attach step(s) (e.g., dispense + placement, then cure/reflow where required).
Run and maintain correct process parameters (temperature/time/pressure, cure profile, reflow settings, dispense settings) and verify they stay within specification.
Ensure die placement meets tolerance requirements (center alignment, rotation/orientation, edge clearance) and verify no die “float” or misregistration occurs during curing.
Monitor die-attach coverage and look for issues such as voids, gaps, edge lifting, or insufficient wetting/adhesion risk.
Perform visual and/or metrology checks as required (alignment checks, attach appearance, pick/place quality, any die shift measurements).
Identify common causes of failure (contamination, improper cure, dispense inconsistency, incorrect substrate condition) and escalate with supporting evidence.
Follow approved rework procedures if applicable; document disposition of defects and support root-cause actions for recurring issues.
Communicate with engineering/quality/production teams on holds, escapes, yield impacts, and process changes; participate in continuous improvement.
Use precision measuring instruments to ensure conformance to a specified tolerance.
Assembles, disassembles, repairs, and reassembles precision assemblies and corrects malfunctions.
Complete in-house Solder, ESD, and FOD certifications.
Use Microsoft Office products.
Use Enterprise Resource Planning Software such as Systems Applications Products in Data Processing (SAP).
Communicate, read, understand, work with small mechanical parts, fiber optic cables, and follow standard operating procedures and assembly instructions.
Ability to work overtime, including staying after normal working hours and weekend work when needed.