Postdoctoral Research Scientist III

University of Arkansas System • Fayetteville, AR

1d • Onsite

About The Position

The University of Arkansas is seeking a Postdoctoral Research Scientist III to conduct research in advanced power electronics packaging. The role contributes to development of advanced power semiconductor modules and packaging technologies, especially for wide-bandgap (WBG) and ultra-wide-bandgap (UWBG) power semiconductor devices rated from 650 V to over 10 kV. The research supports next-generation applications including electric transportation, renewable energy, solid-state transformers, energy storage, and other high-power-density power conversion systems.

The position supports externally funded research projects and involves collaboration with faculty, students, industry partners, semiconductor manufacturers, material and packaging suppliers, and other research organizations. The position is renewable annually, depending on continued need, funding availability, and satisfactory performance. Salary is commensurate with education and experience.

Requirements

• Ph.D. in Electrical Engineering or a closely related field from an accredited institution, conferred by the start date of employment.
• Research experience in power module packaging or closely related power semiconductor packaging technologies.
• Experience in the design, simulation, fabrication, and/or experimental characterization of power semiconductor modules.
• Ability to conduct research independently and collaboratively.
• Strong analytical, organizational, interpersonal, written, and oral communication skills.

Nice To Haves

• Experience with power module packaging materials and fabrication processes, including baseplates, substrates, die attach, soldering, sintering, wire/ribbon bonding, wire-bondless interconnects, and encapsulation.
• Experience with electrical, electromagnetic, thermal, mechanical, and multiphysics modelling and simulation using tools such as ANSYS Q3D, Maxwell, Workbench, LTspice, or equivalent tools.
• Experience in power module experimental characterization, including curve-tracer characterization, double-pulse testing, high-potential testing, partial discharge testing, and switching performance evaluation.
• Experience in power module thermal management, reliability, failure mechanisms, and manufacturability.
• Experience and/or familiarity with commercially available power module packaging platforms and industry-standard module architectures, such as EasyPACK, HybridPACK Drive, DCM, XHP 2, or similar platforms.
• Experience and/or familiarity with emerging and advanced packaging concepts, such as PCB-embedded power semiconductor packaging and other high-density or integrated packaging technologies.
• Experience in advanced power semiconductor module design and packaging technologies, particularly for WBG and UWBG power semiconductor devices.
• Experience and/or familiarity with CAD design and engineering tools such as SolidWorks or equivalent.
• Experience supporting or mentoring graduate or undergraduate researchers.

Responsibilities

• Conduct research in advanced power electronics packaging and power semiconductor modules.
• Develop and evaluate advanced power module packaging concepts and technologies through modelling, simulation, fabrication, and experimental characterization.
• Investigate electrical, thermal, mechanical, reliability, and manufacturability aspects of advanced power module packaging.
• Contribute to externally funded research projects and collaborate with faculty, students, industry partners, and other research organizations.
• Maintain regular, reliable, and non-disruptive attendance and collegial, harmonious working relationships.

Benefits

• Health insurance
• Dental insurance
• Life insurance
• Disability insurance
• Tuition waivers for employees and their families
• 12 official holidays
• Immediate leave accrual
• Retirement programs with university contributions ranging from 5% to 10% of employee salary

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree