Piping Workface Planner

Bechtel Corporation•New Albany, OH
•Onsite

About The Position

Bechtel is building Phase 1 of the Ohio One semiconductor manufacturing plant in New Albany, Ohio. The Piping Workface Planner develops and maintains Installation Work Packages (IWPs) for piping construction scopes in accordance with the project’s Advanced Work Packaging (AWP) program. Reporting to the AWP Manager, the planner independently translates Construction Work Packages (CWPs) into field-ready, constraint-free IWPs that provide piping superintendents, foremen, and craft with the information needed to install work safely, efficiently, and in the correct sequence. The planner works with piping field engineers, superintendents, project controls, materials management, the fabrication shop and spool yards, design engineers, and discipline planners to identify and remove constraints, verify spool and bulk material availability, and maintain a backlog of released packages supporting the construction schedule across the Fab, support buildings, utility facilities, and underground scopes. The role also includes field walkdowns, package tracking and closeout, coordination across disciplines, and use of AWP and 3D model tools. The position is based in New Albany, Ohio, and is listed as full-time office/project telework. National or international family relocation is authorized.

Requirements

  • Bachelor’s degree or international equivalent and 5–8 years of relevant experience, or 9–12 years of relevant work experience.
  • Intermediate to proficient understanding of piping construction methods, including spool installation, field welding, supports, valves and in-line components, and above- and below-ground installation.
  • Ability to read and interpret isometrics, P&IDs, orthographics, spool drawings, line lists, piping specifications, and other design drawings.
  • Working knowledge of Advanced Work Packaging principles, including CWPs, IWPs, constraint management, and package release and closeout.
  • Familiarity with ASME B31.3 and its welding, examination, and pressure testing requirements as they affect package content and sequence.
  • Understanding of applicable Bechtel work processes, including Standard Work Process Procedures and Bechtel Core Processes related to the area of responsibility.
  • Knowledge and understanding of the Project Environmental, Safety & Health (ES&H) Handbook and Bechtel’s Zero Accidents safety program.
  • Computer literacy in word processing, spreadsheet, and database applications.
  • Excellent communication, organization, and problem-solving ability.
  • Physical ability to conduct field inspections involving extensive walking around a construction site, climbing ladders and scaffolding, working on elevated platforms and uneven surfaces, and working in small or confined spaces.

Nice To Haves

  • Workface planning or work packaging experience on large industrial, power, petrochemical, or semiconductor projects.
  • Experience with AWP and 3D model tools such as Navisworks, and project scheduling software such as Primavera P6.
  • Familiarity with Bechtel Standard Applications (BSAPs), including TEAMWorks, Aconex, Bechtel Productivity System, and other automation tools used on Bechtel projects.
  • Experience in semiconductor fabrication facilities, including process piping, high-purity systems, and specialty gas and chemical distribution.

Responsibilities

  • Develop Installation Work Packages for piping scopes, including above- and below-ground piping, process and utility piping, high-purity and specialty systems, pipe supports, valves, in-line components, and tie-ins.
  • Break down Construction Work Packages into IWPs sized to project AWP requirements, with clear scope boundaries, work steps, and installation sequences based on isometrics, spool lists, and test package boundaries.
  • Assemble package content, including isometrics, P&IDs, spool and support lists, line lists, piping specifications, weld maps, material lists, ITP and inspection hold points, safety and permit requirements, quantities, and budgeted hours.
  • Identify and track package constraints, including engineering holds, RFIs, material shortages, supports, scaffolding, rigging, access, predecessor work, and permits; work with responsible groups to remove them before release.
  • Verify spool and bulk material availability in the project materials management system and coordinate reservations, staging, and issuing with the warehouse, spool yard, and fabrication shop.
  • Align IWP boundaries with pressure test package and system turnover boundaries, and coordinate with the pipe testing group so installation sequence supports testing and mechanical completion.
  • Coordinate with piping field engineers on design changes, field change documentation, field welds, and constructability issues affecting work packages.
  • Maintain a backlog of constraint-free IWPs ahead of the construction look-ahead schedule and lead package review and release discussions in weekly planning meetings with superintendents and project controls.
  • Perform field walkdowns to confirm package scope, access, and site readiness, and verify field progress against package content.
  • Track IWP status, installed quantities, weld progress, and package closeout; provide progress, forecast, and backlog data to project controls.
  • Close out completed work packages and ensure redlines, weld records, inspection records, and quality documentation are complete and turned over for as-built and turnover requirements.
  • Coordinate interfaces with civil, structural, mechanical, and electrical workface planners to resolve sequencing and area conflicts.
  • Use project AWP and 3D model tools to extract package information and visualize scope, sequence, and constraints.
  • Provide guidance and on-the-job support to junior workface planners on package development and AWP processes.
  • Complete assigned training requirements.

Benefits

  • Robust benefits intended to support employee well-being, career advancement, culture, and time to recharge; specific benefit offerings are not detailed in the posting.
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