Photonics Integration Engineer, MTS

Micron•Boise, ID

7h•$137,000 - $248,000

About The Position

Micron Technology’s Advanced Packaging Technology Development team develops memory, storage, and photonics technologies for AI, high-performance computing, and next-generation data infrastructure. The Photonics Integration Engineer will lead development and integration of silicon photonics and heterogeneous integration technologies for high-performance optical connectivity. The role spans process integration, advanced packaging, device development, and program leadership, taking technologies from concept through manufacturing readiness. The engineer will work with multidisciplinary teams to address complex technical challenges and use AI-enabled engineering tools to accelerate development and improve decision-making. The posting describes Principal, MTS, and SMTS hiring levels, with level determined by experience, technical depth, and qualifications. The advertised position is full-time and has a stated US base salary range of $137,000 to $248,000 per year. Additional compensation may include benefits, bonuses, and equity. Micron offers medical, dental, and vision plans, income-protection programs, paid family leave, paid time off, and paid holidays.

Requirements

PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field, or equivalent experience, and more than 3 years of applicable industry experience; alternatively, a master's degree or comparable experience with more than 5 years of relevant industry experience; or a bachelor's degree or equivalent experience with 7 or more years in the industry.
Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
Experience with process-flow architecture, device integration, design rule development, and tapeout execution.
Demonstrated success leading multifunctional technical projects and using data-driven approaches to solve complex engineering challenges.

Nice To Haves

Experience with silicon photonics, III-V semiconductor technologies, and heterogeneous integration platforms.
Experience with advanced packaging technologies such as hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging.
Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications.
Experience applying AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges.
Strong communication, program leadership, and project management skills, including the ability to influence technical and business collaborators across organizations.

Responsibilities

Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness.
Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures.
Drive process characterization, design of experiments (DOE), yield improvement, defect reduction, root-cause investigations, and process optimization.
Partner with design, device, packaging, manufacturing, and supplier teams on design rule development, tapeouts, and technology transfers.
Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives to improve development efficiency and product performance.