Photonics Integration Engineer, MTS
About The Position
Micron Technology’s Advanced Packaging Technology Development team is seeking experienced engineers for Principal, MTS, and SMTS roles. The hiring level will be determined by the candidate’s years of experience, technical depth, and overall qualifications. The Photonics Integration Engineer will lead development and integration of silicon photonics and heterogeneous integration technologies for high-performance optical connectivity. The role combines process integration, advanced packaging, device development, and program leadership to move technologies from concept through manufacturing readiness. The engineer will work across multidisciplinary teams to address complex technical challenges and use AI-enabled engineering tools to accelerate development and improve decision-making.
Requirements
- A PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field, or equivalent experience, with more than 3 years of applicable industry experience; alternatively, a master’s degree or comparable experience with more than 5 years of relevant industry experience; or a bachelor’s degree or equivalent experience with upwards of 7 years in the industry.
- Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
- Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
- Experience with process flow architecture, device integration, design rule development, and tapeout execution.
- Demonstrated success leading multifunctional technical projects and using data-driven approaches to solve sophisticated engineering challenges.
Nice To Haves
- Experience with silicon photonics, III-V semiconductor technologies, and heterogeneous integration platforms.
- Experience with advanced packaging technologies, including hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging.
- Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications.
- Experience applying AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges.
- Strong communication, program leadership, and project management skills, with the ability to influence technical and business collaborators across organizations.
Responsibilities
- Develop and optimize end-to-end process integration flows for silicon photonics technologies, from concept through manufacturing readiness.
- Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures.
- Drive process characterization, design of experiments (DOE) execution, yield improvement, defect reduction, root-cause investigations, and process optimization.
- Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers.
- Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives that improve development efficiency and product performance.
Benefits
- Medical, dental, and vision plan options.
- Income-protection benefit programs for illness or injury.
- Paid family leave.
- Paid time off.
- Paid holidays.
- Additional compensation may include bonuses and equity.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
Education Level
Ph.D. or professional degree
