PCB Design Engineer

SAAZ Micro Inc.•Camarillo, CA

17h

About The Position

SAAZ Micro is seeking a talented PCB Design Engineer to design printed circuit board electronics for next-generation electro-optical (EO), infrared (IR), and visible camera products used in aerospace, defense, autonomous systems, and scientific imaging. The engineer will work closely with Product Engineering, FPGA, Digital IC, Mechanical, Software, and Systems Engineering teams to design, develop, integrate, and validate camera electronics from concept through production. The ideal candidate has extensive experience designing complex multilayer PCBs with high-speed digital interfaces, precision analog circuitry, image sensors, FPGAs, power electronics, and EMI/EMC best practices.

Requirements

B.S. or M.S. in Electrical Engineering, Computer Engineering, or related field.
5+ years of camera PCB design experience.
Expert knowledge of PCB CAD tools such as Altium Designer, Cadence Allegro, or OrCAD PCB Designer.
Experience designing complex multilayer boards (8–20+ layers).
Strong understanding of controlled-impedance routing, differential pairs, high-speed timing constraints, return-current paths, and crosstalk reduction.

Nice To Haves

Experience interfacing with visible and IR image sensors.
Understanding of power regulation, analog/digital separation, and signal integrity.
Experience with multilayer PCB layout, high-speed digital and mixed-signal design, controlled-impedance routing, differential-pair matching, power integrity, signal integrity, EMI/EMC mitigation, and thermal analysis.

Responsibilities

Design multilayer PCBs for high-performance imaging systems and camera electronics.
Develop PCB layouts from schematics through manufacturing release.
Collaborate with electrical engineers to optimize component placement and routing.
Design boards incorporating FPGAs, DDR3/DDR4/LPDDR memory, CMOS image sensors, ADCs/DACs, ARM processors, power supplies, and precision analog front ends.
Perform high-speed signal integrity layout for interfaces including DDR, USB 3.x, PCI Express, Gigabit Ethernet, Camera Link, CoaXPress, MIPI CSI-2, and LVDS.
Develop camera hardware platforms, including schematic capture and PCB layout for sensor interfaces, power regulation, timing control, and data transmission.
Develop controlled-impedance stack-ups with PCB fabricators.
Ensure compliance with EMI/EMC, thermal, manufacturability, and reliability requirements.
Bring up and debug new hardware using oscilloscopes, logic analyzers, and protocol analyzers.
Document designs and interface specifications and support hardware validation and production.