PCB Design Engineer

Neros Technologies•Torrance, CA

4h•$115,500 - $162,000•Onsite

About The Position

Neros is a defense technology company that designs and manufactures high-performance unmanned systems. As a PCB Design Engineer, you will be responsible for printed circuit board layout across all product lines, from compact airside electronics to ground control hardware. This role involves taking released schematics and managing the entire downstream process, including layer stackup, component placement, controlled-impedance and RF routing, flex and rigid-flex interconnects, and the creation of complete fabrication and assembly drawing packages. You will also manage the Altium library and establish design standards, directly impacting the manufacturability and reliability of all boards produced.

Requirements

7+ years of dedicated printed circuit board layout and design experience on hardware that reached production
Expert proficiency with Altium Designer, including workspace and library management. Recent version experience preferred
Demonstrated personal ownership of a company or corporate CAD library: creating and maintaining footprints and symbols, deriving land patterns, and enforcing naming and revision standards across a design team
Boards and drawing packages designed to IPC standards, including IPC-2221 and IPC-2222 for design, IPC-6012 Class 2 and Class 3 for board qualification, IPC-A-610 and J-STD-001 for assembly acceptability, and IPC-7351 for land patterns
Flex and rigid-flex design experience, including bend area construction, stiffeners and coverlay, designed per IPC-2223 and qualified to IPC-6013
RF and high-speed digital layout expertise: transmission line theory and topology selection (microstrip, stripline, coplanar waveguide), controlled impedance, differential pairs, length and skew matching, reference plane and return path integrity, and via strategy
Experience defining layer stackups and closing impedance calculations directly with fabrication vendors
Fluency producing and releasing complete manufacturing output packages, with a track record of first-pass fabrication and assembly success
A degree in electronics or electrical engineering, or an equivalent depth of hands-on layout experience in place of a degree. We care about the boards you have shipped, not the credential
Ability to work onsite at our Torrance headquarters, and eligibility to work with export-controlled technical data as a U.S. person

Nice To Haves

Altium 365 or Concord Pro workspace administration, managed components, and revision control of ECAD data
IPC CID or CID+ certification
ECAD to MCAD co-design with SOLIDWORKS or Creo, including STEP model exchange and enclosure fit checks before prototype
Signal and power integrity analysis exposure, such as HyperLynx, Ansys SIwave, or field solver based stackup and impedance tools
HDI construction, sequential lamination, microvias, via-in-pad, back-drilling, high layer count (greater than 16) and thicker board stackups
UAV, avionics, defense, medical, or other high-reliability applications where vibration, thermal extremes, and field reliability drive layout decisions
Scripting or automation of repetitive CAD and library tasks

Responsibilities

Own PCB layout on assigned designs from released schematic through fabrication release, including board outline, layer stackup definition, component placement, routing, and design rule closure
Read and interpret schematics from the design engineers and apply the layout practices appropriate to each design
Own the Altium library: footprints, schematic symbols, land patterns, 3D component bodies, design rule and board templates, output jobs, naming conventions, and revision control
Implement high-speed digital, RF, precision analog, and power sections on the same board, applying controlled impedance, differential pair and length matching, and disciplined return path design
Design flexible and rigid-flex circuits, including bend area construction, stiffeners, coverlay, and ZIF terminations
Produce complete fabrication and assembly documentation to IPC Class 2 and Class 3, including fab and assembly drawings, Gerber X2 or ODB++, NC drill, netlists, paste and assembly data, and BOM outputs
Work directly with fabrication and assembly vendors on stackup and impedance confirmation, DFM and DFA feedback, and resolution of manufacturing issues
Establish and maintain the department's PCB design standards, review layouts produced by others, and coordinate external layout resources during design surges