Packaging SIPI Engineer, Sr. Staff
About The Position
Qualcomm Technologies’ Package Electrical Team is hiring an engineer in signal integrity and power integrity. The role works with package and IC designers to optimize package designs and run system simulations to verify system-level constraints before package tape-out. The engineer communicates with PHY owners about specifications for IPs such as LPDDR, PCIe, UFS, USB, and MIPI, and with PCB designers to assess how ball assignment affects system-level performance. The position collaborates across PHY, package, and PCB organizations, provides timely feedback, and updates team design guidelines. It supports automotive products and leads several engineers in multiple international locations. This is a leadership role requiring independent work and the ability to provide technical guidance to upper management for key decisions.
Requirements
- Bachelor’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field and 6+ years of System/Package Design/Technology Engineering or related work experience; OR a master’s degree in one of these fields and 5+ years of related experience; OR a Ph.D. in one of these fields and 4+ years of related experience.
- Ability to work independently and provide technical guidance for key decisions.
Nice To Haves
- Experience in automotive package design and analysis.
- Ability to use AI to enhance team efficiency.
- Experience with SerDes design specifications such as PCIe Gen-x, USB, and UFS in server design.
- Experience with Matlab to automate existing simulation flows.
- Programming experience in C/C++ or scripting experience in Perl/Python.
- Master’s degree or Ph.D. with 15+ years of experience.
- Prior management experience.
- 10 years of experience in DDR/SerDes in package, PCB, or system design related to compute/server standards.
- Experience in electromagnetics and a solid background in transmission-line theory and crosstalk.
- Proficiency with field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity.
- Experience with simulation tools such as ADS and Hspice.
- Working knowledge of Cadence Allegro/APD/Sip or Mentor Xpedition.
Responsibilities
- Perform package extraction for time-domain and frequency-domain analysis.
- Perform system-level analysis for DDR, SerDes, and mixed-signal interfaces.
- Provide design guidelines for package design.
- Perform system simulations and provide feedback for design optimization.
- Develop design and analysis flows and automate processes.
- Create technical documentation and presentations.
- Lead several engineers located in multiple international geographies.
- Communicate with PHY owners and PCB designers to understand interface specifications and assess system-level effects of ball assignment.
Benefits
- Competitive annual discretionary bonus program.
- Opportunity for annual RSU grants, except for employees on sales-incentive plans.
- Competitive benefits package.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
