Packaging Process Engineer - Nova Sensor Fremont

Amphenol Advanced Sensors • Fremont, CA

13d • Onsite

About The Position

The Packaging Process Engineer designs, validates, and refines advanced manufacturing techniques, partnering with others to develop tooling and automation solutions that can scale with next-generation product lines. The role leads the development and continuous improvement of MEMS pressure sensor assembly processes to improve performance, quality, and manufacturability. It develops and validates processes for production and prototype builds, including wire bonding, die attach, overmolding, and encapsulation, with appropriate materials selection. The engineer improves yield and production efficiency using Lean Manufacturing and Six Sigma principles and develops tooling, fixtures, and equipment for scalable, reliable manufacturing. The position collaborates with a cross-functional Engineering team to implement flexible assembly and test platforms for future product lines. It includes hands-on work in a Class 1000 cleanroom for approximately 10% of work time and occasional domestic and international travel to support global operations. The role is on-site in Fremont, California.

Requirements

• Bachelor’s degree in Manufacturing Engineering, Mechanical Engineering, Electrical Engineering, or a related discipline.
• Minimum three years of hands-on engineering experience in a high-volume manufacturing environment; semiconductor, MEMS, or sensor industry experience is ideal.
• Expertise in IC or MEMS packaging processes, including wire bonding, die attach, encapsulation, materials selection, and operation of micro-packaging equipment.
• Working knowledge of quality and process tools, including Design of Experiments (DOE), Failure Mode & Effects Analysis (FMEA), Control Plans, and Statistical Process Control (SPC).
• Demonstrated success developing or supporting products in regulated sectors such as automotive or medical devices.
• Ability to work effectively in a cleanroom while following required gowning and safety protocols.
• Proficiency with Microsoft Office applications, including Excel, Word, PowerPoint, Project, and Access.
• Strong written and verbal communication skills, including the ability to produce clear technical documentation and collaborate with internal teams and customers.
• Proactive, self-motivated approach and ability to work across multiple projects, meet deadlines, and contribute effectively within cross-functional teams.

Nice To Haves

• High-volume manufacturing experience in the semiconductor, MEMS, or sensor industry.

Responsibilities

• Lead the development and continuous improvement of MEMS pressure sensor assembly processes to enhance performance, quality, and manufacturability.
• Design, develop, and validate MEMS assembly processes for production and prototype builds, including wire bonding, die attach, overmolding, and encapsulation, with optimal materials selection.
• Improve product yield and production efficiency through Lean Manufacturing and Six Sigma principles.
• Design, develop, and implement tooling, fixtures, and equipment solutions for scalable and reliable manufacturing.
• Collaborate with the cross-functional Engineering team to conceptualize and implement flexible assembly and test platforms for future product lines.
• Perform hands-on work in a Class 1000 cleanroom environment, approximately 10% of total work time.
• Support global operations with occasional domestic and international travel.
• Apply workstation layout, design optimization, and ergonomic principles to enhance manufacturing efficiency and operator performance.
• Produce clear technical documentation and collaborate with internal teams and customers.

What This Job Offers

• Job Type: Full-time