Packaging Process Development Engineer

Intel Corporation•Chandler, AZ

1d•$99,030 - $188,890•Onsite

About The Position

Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a legacy of over 50 years of technological breakthroughs, Intel empowers billions of people globally through world-class products and solutions. Our teams are made up of bold thinkers, problem-solvers, and innovators who are passionate about shaping the future of technology. At Intel, we believe in creating an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact. Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of advancing next-generation semiconductor packaging technologies, playing a critical part in Intel's product roadmap. You will develop and optimize innovative assembly processes and equipment, directly influencing the performance, reliability, and quality of Intel's cutting-edge products. This is a unique opportunity to make a lasting impact on the semiconductor industry while working alongside some of the brightest minds in the field.

Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years of experience OR master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM field
Knowledge of mechanical design software such as SolidWorks or AutoCAD.
Mechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principles

Nice To Haves

2+ years of experience in Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
Drive technical innovation and manage complex, time-sensitive projects.
High-precision manufacturing methods, including stamping and CNC machining.
Semiconductor fabrication processes and packaging technologies.
Supply chain management in a manufacturing or materials qualification environment.

Responsibilities

Develop and optimize assembly media and collaterals to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities, documenting findings through detailed technical reports.
Design and maintain equipment to evaluate media and collateral performance under simulated field conditions, including temperature cycles, heat, humidity, and dynamic mechanical forces.
Ensure manufacturability of physical prototypes and oversee the full lifecycle of manufacturing workflows.
Define material specifications and collaborate closely with supplier quality and procurement teams to maintain compliance with quality and performance benchmarks.
Leverage a deep understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements.
Lead problem-solving initiatives and champion continuous improvement efforts for media and collaterals.
Standardize manufacturing qualification practices and quality systems while managing technical risks in alignment with product milestones and supplier delivery schedules.
Serve as a subject matter expert, providing technical consultation to internal teams and external partners on media and collateral solutions.