Advanced Packaging Technology Development Process Integration Engineer

Intel•Rio Rancho, NM

6d•$115,110 - $219,550•Onsite

About The Position

Intel Corporation is one of the world's most innovative and respected technology companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. With a legacy of over 50 years of semiconductor leadership, Intel continues to push the boundaries of what's possible in computing, connectivity, and advanced manufacturing. Our Advanced Packaging Technology & Manufacturing (APTM) organization is at the cutting edge of silicon packaging innovation, developing the next generation of semiconductor solutions that will power the devices and systems of tomorrow. Intel's New Mexico site, located in Rio Rancho, is a world-class semiconductor manufacturing facility and a cornerstone of Intel's U.S. manufacturing strategy. Joining our team here means becoming part of a passionate, collaborative community of engineers and innovators who are committed to making a real difference. We are seeking a talented and motivated Process Integration Engineer to join our APTM Silicon Manufacturing Technology Development organization in Rio Rancho, New Mexico. In this role, you will be at the heart of enabling Intel's advanced packaging manufacturing roadmap, developing upcoming technology nodes, and ensuring that new processes are robust, reliable, and ready for high-volume manufacturing. You will work at the intersection of process development, yield improvement, and cross-functional collaboration — partnering with module teams, device engineers, reliability specialists, and other key stakeholders to deliver base die solutions that align with Intel's packaging roadmap. This is a high-impact role where your contributions will be visible, meaningful, and directly tied to the success of Intel's next-generation products.

Requirements

Bachelor’s degree in engineering, material science, physics, or a related field with 3+ years of relevant experience, OR Master's degree with 2+ years of relevant experience, OR PhD with no prior experience required.
Relevant experience in Technology Development and/or high-volume manufacturing environment can be any of the following: Process integration, yield analysis, quality management, defects reduction, and process development.
Knowledge of semiconductor advanced packaging techniques and flows.

Nice To Haves

3+ years of experience: Leading cross-functional problem-solving initiatives and drive results in a complex and fast-paced environment.
Advanced packaging technologies such as 2.5D, 3D IC, fan-out, or flip chip.
Prior experience supporting technology transfer to high-volume manufacturing environments.
Value engineering and an innovative mindset to identify cost-effective solutions.

Responsibilities

Enable Intel's advanced packaging manufacturing roadmap by developing and qualifying upcoming technology nodes.
Own and drive closure of defect, yield, reliability, and device entitlement gaps across processes under development.
Collaborate closely with process module teams to support process readiness reviews and transfer milestones, ensuring newly developed processes meet the standards required for high-volume manufacturing.
Partner with device, yield, reliability, and packaging teams — as well as internal and external stakeholders — to develop and deliver robust base die solutions.
Contribute to value engineering initiatives, identifying cost-effective solutions without compromising quality or performance.
Support cross-functional problem-solving efforts, driving results in a fast-paced and technically complex environment.