Advanced Packaging Process Engineer

Intel•Chandler, AZ

14h•Onsite

About The Position

Intel is one of the world's most iconic technology companies, driving innovation in semiconductors for over five decades. From the chips that power your laptop to the processors enabling artificial intelligence and autonomous vehicles, Intel's technology is woven into the fabric of modern life. Our Advanced Packaging Technology Manufacturing (APTM) organization is at the heart of Intel's next chapter — developing and commercializing the packaging technologies that will define the future of computing. We are committed to building a diverse, inclusive, and innovative workplace where every employee can do their best work and make a real difference. We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes — work that directly enables Intel's products to reach billions of people around the world. Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry.

Requirements

Master's and 3+ years in relevant experience, or PhD in Mechanical Engineering, Physics, Chemistry, or a related STEM field with 1+ years of experience.
Process development and equipment qualification in a manufacturing setting.

Nice To Haves

3+ years of experience in: Data analysis and risk assessment methodologies.
Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
Semiconductor fabrication processes, assembly methodologies, and packaging flows (e.g., flip chip, fan-out, 2.5D/3D integration).
Programming languages such as Python, MATLAB, or SQL for complex data analysis.
Quality systems, documentation standards, and packaging reliability evaluation tools.

Responsibilities

Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments.
Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE) to characterize processes and drive continuous improvement.
Innovate new techniques, materials, and tools to address emerging challenges in semiconductor packaging performance and reliability.
Collaborate with cross-functional teams across engineering, manufacturing, and product development to identify technical risks and ensure successful product launches.
Establish specifications for materials and equipment, ensuring adherence to Intel's quality and operational standards.
Document and communicate technical findings, process improvements, and experimental results through reports, white papers, and qualification documents.
Lead standardization efforts for manufacturing systems, equipment setups, and process flows across Intel's global sites.