Packaging Integration Engineer (2026 New College Graduate)

GlobalFoundries•Essex Junction, VT

8d•$85,000 - $146,000

About The Position

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. In this role, you will collaborate with cross-functional engineering teams to support the development and manufacturing of electro-optical transceivers utilizing GF’s Photonix platform and advanced 2.5D/3D packaging technologies. The engineer will contribute to package integration, process development, reliability characterization, and data analysis activities while gaining hands-on experience in advanced semiconductor packaging technologies. This position offers an opportunity to work alongside experienced engineers and develop technical expertise in silicon photonics, assembly processes, and next-generation packaging solutions.

Requirements

Graduating with a Bachelors, Master’s, or PhD degree in Materials Science Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM discipline from an accredited degree program.
Must have at least an overall 3.0 GPA and proven good academic standing.
Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies gained through coursework, research, internships, co-ops, or academic projects.
Demonstrated analytical and problem-solving skills.
Experience analyzing experimental or engineering data.
Ability to work effectively within cross-functional teams.
Language Fluency - English (Written & Verbal).
Travel up to 10%.

Nice To Haves

Prior related internship, co-op, research, or academic project experience in semiconductor packaging, silicon photonics, reliability engineering, failure analysis, materials characterization, thermal or mechanical simulation, or process integration.
Familiarity with Design of Experiments (DOE) methodologies.
Experience with statistical data analysis tools.
Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.
Demonstrated prior leadership experience in the workplace, school projects, competitions, research groups, or student organizations.
Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills.
Strong planning and organizational skills.

Responsibilities

Support assembly process integration activities for silicon photonics and advanced packaging products.
Assist with process development, characterization, and qualification activities for new package technologies.
Analyze engineering and manufacturing data to identify process improvement opportunities.
Participate in failure analysis and root cause investigations for packaging and assembly-related issues.
Support package reliability testing and characterization activities.
Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.
Contribute to design rule development and manufacturability assessments for new products.
Document experimental results and communicate findings through presentations and technical reports.
Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.