Packaging Design Integration Engineer (2026 New College Graduate)

GlobalFoundries•Essex, VT

5d•$85,000 - $146,000

About The Position

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies. The engineer will contribute to thermal, mechanical, electrical, and optical design integration activities, including design rule development, simulation/modeling support, manufacturability assessments, and reliability-focused design characterization. This role offers hands-on exposure to next-generation packaging solutions while building technical depth in silicon photonics, advanced packaging design, and engineering analysis.

Requirements

Graduating with a Bachelor’s, Master’s, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program.
Must have at least an overall 3.0 GPA and proven good academic standing.
Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co-ops, or academic projects.
Demonstrated analytical and problem-solving skills.
Experience analyzing experimental, simulation, or engineering data.
Ability to work effectively within cross-functional teams.
Language Fluency - English (Written & Verbal).

Nice To Haves

Prior related internship, co-op, research, or academic project experience in advanced packaging, silicon photonics, chip package interaction, thermal/mechanical/electrical/optical design, reliability engineering, or process integration.
Familiarity with design or modeling tools such as HFSS, Zemax/Zmax, FloTHERM, finite element analysis, electrical simulation, optical simulation, or related engineering software.
Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.
Familiarity with Design of Experiments (DOE), engineering statistics, or data analysis methods.
Demonstrated prior leadership experience in the workplace, school projects, competitions, research groups, or student organizations.
Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills.
Strong planning and organizational skills.

Responsibilities

Support packaging design integration activities for silicon photonics and advanced packaging products.
Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.
Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.
Use engineering data, simulations, and characterization results to help evaluate design options and identify improvement opportunities.
Participate in cross-functional problem-solving efforts related to technical, yield, quality, and reliability concerns.
Support development and documentation of design guidelines, technical reports, and presentation materials.
Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.
Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.