Packaging Engineering Intern - Summer
About The Position
The fab2 team is seeking Semiconductor Packaging Engineering Interns for the summer term, with a preferred commitment of 4 to 8 months, starting in May or June. This is a hands-on engineering role focused on end-to-end process development and integration for semiconductor packaging. Interns will be actively involved in research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. The team utilizes tools such as 3D printing, metal plating, lasering, and metrology, with a philosophy of rapid iteration and testing. A portfolio showcasing built projects is required, demonstrating experience with medium-to-high complexity systems through personal projects or previous internships.
Requirements
- Pursuing a Bachelor’s Degree or higher in engineering
- At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
- Hands-on prototyping experience and the ability to move through design cycles quickly
- Portfolio required: show us the things you’ve actually built!
- If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here.
Nice To Haves
- Proven experience in mechatronics or electromechanical system design
- Familiarity with lasering and 3D printing (stereolithography)
- Reliability testing, soldering, and reflow testing
- Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
- Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
- Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
- Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Benefits
- Housing Stipend to help with first month expenses
- Lunches daily
- Dinners 3x per week
- Stocked Office Kitchen with Snacks and Spindrifts
- Weekly Learning & Development opportunities
- Commuter Benefits including Parking and Late Night Uber rides from the office
- Paid Time Off inclusive of Holidays and Sick Time
- Visa Sponsorship
- Medical, Dental, and Vision insurance
- 401(k) retirement plan
- Life and Disability Insurance
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What This Job Offers
Career Level
Intern
