Package Technology Development Engineer

Cisco • San Jose, CA

3d

About The Position

Cisco is seeking a seasoned Packaging Technical Leader to join the Packaging Technology & Quality team within our world-class Global Supply Chain. As a Technical Leader you will drive innovation in advanced packaging technology and quality for Cisco’s cutting-edge ASIC and silicon photonic products. You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and multi-functional environment. This includes close partnerships with design engineering, operations, and supply chain teams to innovate next-generation technologies. You will also engage directly with counterparts at OSATs, Fabs, contract manufacturers and other key suppliers leading technical discussions and problem-solving efforts as well as influencing commodity strategy at a global scale. This role offers significant technical scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms.

Requirements

• 7+ years of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable track record of technical leadership and successful project execution.
• Knowledge of advanced packaging processes (bumping, flip-chip, TSV, 2.5D/3D, MCM) and materials
• Experience with package reliability & qualification, FMEA, structured problem solving methods like 8D, and physical failure analysis techniques

Nice To Haves

• Familiar with wafer- and package level-test and debug as well as ATE platforms and test HW.
• Familiarity or experience with co-packaged optics is a plus
• Experience with volume manufacturing
• Experience with advanced simulation tools for package design and reliability analysis
• Ability to work within and lead projects with highly multi-functional and geographically distributed technical teams.

Responsibilities

• Serve as a technical leader in advanced packaging technology development(2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing.
• Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products.
• Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions.
• Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM.

Benefits

• medical, dental and vision insurance
• a 401(k) plan with a Cisco matching contribution
• paid parental leave
• short and long-term disability coverage
• basic life insurance
• Cisco restricted stock units
• 10 paid holidays per full calendar year
• 1 floating holiday for non-exempt employees
• 1 paid day off for employee’s birthday
• paid year-end holiday shutdown
• 4 paid days off for personal wellness
• 16 days of paid vacation time per full calendar year (non-exempt)
• flexible vacation time off program (exempt)
• 80 hours of sick time off provided on hire date and each January 1st thereafter
• up to 80 hours of unused sick time carried forward
• Optional 10 paid days per full calendar year to volunteer
• annual bonuses (for non-sales roles)

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: No Education Listed