Infineon Technologies is hiring a Graduate Package Development Engineer for its HiRel Package Group. The role focuses on managing package design and development projects from material selection and prototype builds through qualification and new product introduction. The engineer will ensure designs meet quality and reliability criteria for HiRel applications, develop and maintain design rules and Design for Manufacturing (DFM) standards, and collaborate with the package design team to release robust, reliable packages into production. The position also contributes to a collaborative, innovative, and resilient packaging team. The position is intended for someone graduating in Spring 2027 with a master’s or PhD in a relevant engineering or materials field. Candidates must meet U.S. export-control eligibility requirements by providing proof of U.S. citizenship, permanent U.S. residency, or protected-individual classification. The listed salary range for Leominster, Massachusetts is $80,000–$94,000, and employees are eligible to participate in an incentive plan. Employment is contingent on proof of the legal right to work in the United States, satisfactory references, a background check and drug test, and completion of onboarding documents.
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Job Type
Full-time
Career Level
Entry Level