Optoelectronic IC Package Design Director
About The Position
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules. How You Will Make an Impact:
Requirements
- BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus)
- 10+ years hands on experience with IC package design experience
Nice To Haves
- Substrate design experience for RF, digital, high speed and mixed signal designs
- Thorough understanding of signal and power integrity fundamentals
- Experience with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
- Fluent in SI/PI and EM simulation tools such as SIWave and HFSS
- Experience in package design electrical review, SI/PI analysis
- Experience in package design for manufacturing reviews
- Experience in thermal and mechanical design is a plus
- Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
- Problem solver with strong engineering fundamentals
Responsibilities
- Own and drive advanced package selection, new product BGA configuration, and package structure
- Own and manage package development schedules
- Responsible for package layout, SI/PI optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
- Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
- Simulate and optimize signal and power integrity and RF performance of the package design
- Interface and work with CMs and vendors for sourcing existing designs and future product development
Benefits
- medical, dental, and vision plans
- participation in 401(K) (USA) & DCPP (Canada) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company-paid holidays
- paid sick leave
- vacation time
- Paid Family Leave
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What This Job Offers
Job Type
Full-time
Career Level
Director
