MTS - Optical Interconnect Design Architect

Micron Technology • Richardson, TX

2d

About The Position

Micron is seeking an experienced Optical Interconnect Design Architect to define and drive next-generation optical connectivity solutions enabling future memory, AI accelerator, and high-performance computing platforms. This role will lead architecture development, technology pathfinding, feasibility analysis, and ecosystem engagement required to enable scalable optical interconnect solutions. The successful candidate will evaluate emerging photonic technologies, develop optical I/O architectures, guide proof-of-concept implementations, and collaborate with internal and external partners to identify solutions that meet future bandwidth, energy efficiency, thermal, reliability, and manufacturability requirements. The architect will influence Micron's long-term optical interconnect roadmap spanning photonic interposers, silicon photonics, optical memory interfaces, co-packaged optics, optical networking, and advanced heterogeneous integration technologies.

Requirements

• Demonstrated experience in one or more of the following: Optical Interconnect Architecture, Silicon Photonics, High-Speed I/O Systems, Optical Communication Systems
• Strong understanding of: Optical communication fundamentals, Wavelength Division Multiplexing (WDM/DWDM), Optical link budgeting, Photonic Integrated Circuit design
• Experience performing architecture-level tradeoff analysis involving performance, power, thermal, cost, and scalability metrics.
• Apply AI assisted analysis to evaluate architectural tradeoffs and technology benchmarking.
• Working knowledge of advanced semiconductor packaging technologies including chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration.
• Proven ability to drive technical initiatives across multiple engineering disciplines.
• PhD in Electrical Engineering, Optics, Photonics, Physics, Computer Engineering, or a related technical discipline with 5+ years of industry experience; or Master's degree with 8+ years of relevant industry experience.

Responsibilities

• Drive architecture exploration and technology pathfinding that bridges current high-speed electrical I/O and die-to-die interconnect solutions with future optical interface technologies for AI, HBM, and chiplet-based systems.
• Define optical interconnect architectures for next-generation memory and AI computing systems.
• Lead architectural tradeoff studies across electrical and optical interconnect technologies, evaluating bandwidth density, latency, power efficiency, thermal performance, reliability, and cost.
• Develop optical I/O architectures incorporating Photonic Integrated Circuits (PICs), modulators, detectors, Waveguide technologies, packaging and fiber interfaces, Silicon photonics integration
• Assess emerging technologies including Optical Interposers, Co-Packaged Optics (CPO), and Near-Package Optics (NPO).
• Drive proof-of-concept demonstrations and technology pathfinding activities for future HBM and die-to-die optical interconnect solutions.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior