MTS - Optical Interconnect Design Architect

Micron • Richardson, TX

1d

About The Position

Micron is seeking an experienced Optical Interconnect Design Architect to define and drive next-generation optical connectivity solutions for future memory, AI accelerator, and high-performance computing platforms. The role leads architecture development, technology pathfinding, feasibility analysis, and ecosystem engagement to enable scalable optical interconnect solutions. The architect evaluates emerging photonic technologies, develops optical I/O architectures, guides proof-of-concept implementations, and collaborates with internal and external partners to address future bandwidth, energy efficiency, thermal, reliability, and manufacturability requirements.

The position influences Micron’s long-term optical interconnect roadmap, including photonic interposers, silicon photonics, optical memory interfaces, co-packaged optics, optical networking, and advanced heterogeneous integration technologies. The job title and level may scale depending on experience and qualifications.

Requirements

• PhD in Electrical Engineering, Optics, Photonics, Physics, Computer Engineering, or a related technical discipline, with 5 or more years of industry experience; or a master’s degree with 8 or more years of relevant industry experience.
• Demonstrated experience in at least one of the following: optical interconnect architecture, silicon photonics, high-speed I/O systems, or optical communication systems.
• Strong understanding of optical communication fundamentals, wavelength division multiplexing (WDM/DWDM), optical link budgeting, and photonic integrated circuit design.
• Experience conducting architecture-level tradeoff analysis involving performance, power, thermal, cost, and scalability metrics.
• Working knowledge of advanced semiconductor packaging technologies, including chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration.
• Ability to drive technical initiatives across multiple engineering disciplines.

Responsibilities

• Drive architecture exploration and technology pathfinding connecting current high-speed electrical I/O and die-to-die interconnect solutions with future optical interfaces for AI, HBM, and chiplet-based systems.
• Define optical interconnect architectures for next-generation memory and AI computing systems.
• Lead architectural tradeoff studies across electrical and optical interconnect technologies, assessing bandwidth density, latency, power efficiency, thermal performance, reliability, and cost.
• Develop optical I/O architectures incorporating photonic integrated circuits (PICs), modulators, detectors, waveguide technologies, packaging, and fiber interfaces, including silicon photonics integration.
• Assess emerging technologies, including optical interposers, co-packaged optics (CPO), and near-package optics (NPO).
• Drive proof-of-concept demonstrations and technology pathfinding for future HBM and die-to-die optical interconnect solutions.
• Apply AI-assisted analysis to evaluate architectural tradeoffs and technology benchmarks.
• Drive technical initiatives across multiple engineering disciplines.

Benefits

• Choice of medical, dental, and vision plans.
• Benefits that help protect income in the event of illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree