MTS Wet Process Engineer, Advanced Packaging

Micron Technology • Boise, ID

1d

About The Position

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. By collaborating closely with our global R&D teams, materials suppliers, and manufacturing teams, we ensure the efficient development, transfer, and implementation of new technology nodes to maintain Micron's leadership in the industry. As a Member of Technical Staff Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management. You will also be required to resolve assembly process-related problems by applying failure analysis, FMEA, 8D, or SPC/FDC methodology. Additional responsibilities include leading and participating in yield improvement and cost reduction activities and handling new process baseline qualifications. You may conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

Requirements

• MS in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field
• 12+ years of direct experience working as a process development engineer with an Advanced Packaging focus on DRAM, NAND, or other memory products
• Excellent data collection, organization, and analysis skills with experience using Python and statistics software
• Skills and experience with material properties and characterization techniques
• Experience using statistics and model-based problem solving to find solutions to problems
• Skilled at crafting valid tests and Design of Experiments (DOE)

Nice To Haves

• PHD in Material Science, Chemical Engineering, or Chemistry with at least 10 years specifically in Advanced Packaging within the semiconductor industry
• Substantial hands-on experience with wet chemistry development in a cleanroom environment
• Experience leveraging AI and automation for data analysis and process-improvement

Responsibilities

• Identify, diagnose, and resolve assembly process-related problems
• Coordinate and implement process, equipment, and material evaluation/optimization initiatives and implement changes at process step
• Validate and fan out innovative processes, tools, and/or materials for new product introduction
• Develop, optimize, and characterize wet chemistry processes to meet the requirements of pioneering advanced packaging products
• Support SPC/FDC/RMS/APC
• Support site-to-site portability
• Manage and audit material suppliers to achieve quality, cost, and risk management objectives
• Support internal and external audits

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior