Wet Etch Process Engineer

MACOM•Lowell, MA

4d•Onsite

About The Position

In this critical role you will be responsible for the Wet Etch processes within MACOM’s internal semiconductor fab. The product portfolio includes GaN, GaAs, Si, and InP based technologies. Responsibilities include development, continuous improvement, and sustaining processes all in close partnership with Integration Engineering as well as Business Unit design teams. Excellent judgment, a strong knowledge of semiconductor processing, and an optimistic, can-do approach are essential to success in this role.

Requirements

BS or MS degree in Engineering or Physics with at least 5 years of fab experience.
Demonstrated knowledge in silicon and compound semiconductor wet processes (wet etch/wet clean) and material system.
Strong understanding of data mining and statistics, SPC, and DOE.
Familiarity with Lean manufacturing and structured problem solving.
Proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.
Strong sense of ownership, drive and dedication to continuous improvement.
Enthusiastic boldness for taking on aggressive goals and a commitment to achieving them.
Excellent verbal/written communication skills.
Detail-oriented with strong organizational skills.
Must be a U.S. Person (U.S. citizen, U.S. national, lawful permanent resident, or individual granted asylum or refugee status) due to ITAR regulations.

Responsibilities

Development, continuous improvement, and sustaining of Wet Etch processes.
Collaborate with equipment engineers and integrations engineers for new tool qualification.
Identify and resolve issues affecting current production.
Work collaboratively with cross functional teams to improve processes.
Technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.