Module Process Engineer Director - (E6)

Applied MaterialsAlbany, NY
Onsite

About The Position

Module Process Integration Engineering Director needed to explore and build novel devices and modules in derivative and specialty market technology segments. Hands-on experience in semiconductor and packaging process environments is preferred. An understanding of the relationships between device design, material physics and functional characterization is ideal. A passionate drive, a curious mind and adaptable spirit are expected. This role demands a clear, organized and thoughtful communicator who is willing to collaborate with external customers seeking to leverage the process capability of Applied Materials to solve their complex, real world challenges.

Requirements

  • Demonstrated experience in integration of integrated devices in FEOL & BEOL processing and wafer level packaging.
  • Experience in end to end technology development including: process assumptions, ground rule generation, test site coordination and tape out, test site scheduling, setup and installation, route pipe cleaning, wafer processing logistics, test and characterization and process debug.
  • Demonstrate understanding of measurement techniques used to characterize physical and electrical properties of materials, with demonstrated experience in at least one technique.
  • Working understanding of various semiconductor devices, such as Diodes, Transistors, MOS, MIM etc.
  • Working understanding of the relationship between a device’s design, material composition and its functional behavior.
  • Working Understanding of techniques commonly used to characterize integrated device structures, such as, but not limited to, reliability, construction analysis, and/or functional circuit characterization, is preferred.
  • Enjoys working in team-oriented, collaborative environments.

Nice To Haves

  • Hands-on experience in semiconductor and packaging process environments is preferred.
  • An understanding of the relationships between device design, material physics and functional characterization is ideal.
  • A passionate drive, a curious mind and adaptable spirit are expected.
  • Solves complex problems; takes a broad perspective to identify innovative solutions.
  • Works independently, requiring minimal guidance.
  • Will work with cross-functional teams on projects.
  • Understanding of how to develop, integrate and scale processes for device fabrication.
  • Will question and challenge assumptions and practices used to improve products, processes or services.
  • Will take initiative to support functional teams or projects with moderate resource requirements, risk, and/or complexity.
  • Uses analytical approach to make decisions and identify innovative solutions.
  • Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies and directed by leads and managers.
  • Communicate concepts and negotiate with others to adopt a different point of view.
  • Strong presentation and oratory skills for both internal team, executive communication, and external customer presentations.

Responsibilities

  • Conceive, design, execute and analyze experiments to demonstrate viability and scalability of proof-of-concept devices.
  • Identify key metrics, prepare project plans and drive multi-party collaborations from conception to implementation. Will participate in the development of strategies, processes and resources.
  • Participates on multifunctional design teams comprised of internal, external and/or matrixed headcount to complete projects. Provides technical input to team members to achieve project goals.
  • Communicate and report status in a clear and organized fashion, tailoring message as needed to their audiences such as peers, management, leadership and clients.
  • Identifies and resolves potential complications within the project, and develops solutions for resolution.

Benefits

  • supportive work culture that encourages you to learn, develop, and grow your career
  • comprehensive benefits package
  • participation in a bonus and a stock award program
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