Module Development Engineer

Intel Corporation•Hillsboro, OR

23h•$99,030 - $162,500•Onsite

About The Position

Module Packaging Media Engineers provide project management, media design/development, and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, and/or completed units. The responsibilities include but are not limited to the following: Responsible for the thermal/mechanical/electrical design, analysis, and development of media. Defines overall package performance and specification and realizes technology certification through qualification plans and data collection. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and engineering judgment.

Requirements

Bachelor's degree in mechanical engineering or related STEM field and 4+ years of experience OR a Master's degree in the same fields with 2+ year of experience.
Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience.
Full cycle project management experience.

Nice To Haves

3+ years of experience with one or more of the following:
Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems.
Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process.
Stakeholder management (ex.supplier/ project management/internal partner management)
Semiconductor devices and packaging processes and technology.
Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.
Media design experience
Equipment collateral experience

Responsibilities

Responsible for the thermal/mechanical/electrical design, analysis, and development of media.
Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
Conducts tests and research on basic materials and properties.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
Provides consultation concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur.
Develops solutions to problems utilizing formal education and engineering judgment.