Module Development Engineer

Intel Corporation•Hillsboro, OR

23h•$99,030 - $139,810•Onsite

About The Position

Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, and/or completed units. Responsibilities include but are not limited to the following: Responsible for the thermal/mechanical/electrical design, analysis, and development of collaterals. Defines overall package performance and specification and realizes technology certification through qualification plans and data collection. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and engineering judgment.

Requirements

Candidate must possess a bachelor's degree in mechanical engineering or related STEM field and 6+ months of experience.
Mechanical Design, CAD/SolidWorks/Drive works/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience.

Nice To Haves

3+ years of experience with one or more of the following: Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems.
Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process.
Stakeholder management (ex.supplier/ project management/internal partner management)
Semiconductor devices and packaging processes and technology.
Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.

Responsibilities

Responsible for the thermal/mechanical/electrical design, analysis, and development of collaterals.
Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
Conducts tests and research on basic materials and properties.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
Provides consultation concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur.
Develops solutions to problems utilizing formal education and engineering judgment.