Module Development Engineer

Intel•Hillsboro, OR

20h•Onsite

About The Position

Engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We innovate leading edge fabrication processes and continue to overcome seemingly impossible barriers as tolerances and specifications for building best-in-class computing devices become increasingly rigorous. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and architectures, enabling rapid miniaturization in the semiconductor industry and the mass production of integrated circuits. CMP techniques leverage physics, chemistry, materials science and surface science concepts, and exist at the intersection of these disciplines. As a result, our team has a diverse set of scientific backgrounds that relies on strong collaboration and shared learning.

Requirements

PhD degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM (Science Technology Engineering Math) field of study (with a focus on hands-on experimental research).
Must be able to start within 12 months

Nice To Haves

Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles, and engineering analysis tools
Experimental lab work
Semiconductor and transistor device physics
Advanced transistor device structures and architectures including fabrication (e.g., lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.) with in-depth knowledge of semiconductor device physics and process integration
Data analysis skills with demonstrated ability to construct clear data-based problem statements
Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.)
Design of experiments
Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing
Statistical, data analysis (MATLAB, Excel, JMP, etc.)

Responsibilities

Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap