Packaging Module Development Engineer

Intel•Chandler, AZ

1d•Onsite

About The Position

As a Packaging Module Development Engineer within Intel's Assembly Technology Development (ATD) team, you will be at the forefront of innovation, driving the advancement of cutting-edge semiconductor packaging technologies that power the future of computing. Your work will enable Intel's leadership across mobile, edge, and hyperscale computing platforms by developing and optimizing industry-leading package assembly solutions. This dynamic role offers the unique opportunity to collaborate with cross-disciplinary teams, innovate across materials, equipment, and processes, and scale advanced packaging platforms for high-volume manufacturing. Your contributions will directly impact quality, reliability, and manufacturability, ensuring Intel's roadmap stays ahead of the curve in delivering transformative technologies.

Requirements

Bachelor's or BS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 4+ years of relevant experience -OR- Master's or MS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 3+ years of relevant experience - OR- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 1+ years of relevant experience
Demonstrated expertise in metrology solutions for semiconductor and assembly technologies
Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE).

Nice To Haves

Demonstrated expertise in packaging fundamentals, quality and reliability standards, and redistribution layers (RDL) packaging.
Experience in technology development, including delivering results for complex and time-critical technical projects.
Familiarity with semiconductor fabrication processes, assembly technologies, and materials.
Previous related work experience in a semiconductor foundry preferred

Responsibilities

Develop First Level, Second Level, and Mid-Level Interconnect (FLI, SLI, MLI), as well as thermal and surface mount technology (SMT)/printed circuit board (PCB) metrology solutions, to support Intel's advanced packaging platforms.
Collaborate with multifunctional teams to optimize assembly processes, focusing on quality, reliability, cost, yield, productivity, and manufacturability.
Innovate next-generation materials, equipment, and fabrication techniques to advance semiconductor packaging capabilities.
Conduct process development and equipment characterization through statistical techniques such as Statistical Process Control (SPC) and Design of Experiments (DOE).
Manage dynamic technical projects to meet critical product development timelines.
Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.
Partner with suppliers and cross-organizational teams to ensure material specifications and quality requirements are met.
Lead efforts in identifying and addressing potential package quality and reliability challenges through innovative techniques and tools.