Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•$115,110 - $162,500•Onsite

About The Position

Join Intel's Advanced Packaging Substrate Technology Development team as a Packaging Module Development Engineer and play a pivotal role in shaping the future of advanced packaging solutions. You will be at the forefront of developing cutting-edge assembly processes and equipment that enable Intel's roadmap for innovative assembly packaging technologies. In this role, you will contribute to optimizing manufacturing processes, improving product quality, reliability, and yield, while pushing the boundaries of technology to meet the demands of a rapidly evolving semiconductor industry. You will collaborate with cross-functional teams, explore innovative solutions, and drive breakthroughs in packaging technology that directly impact Intel's success in the global market. This position is ideal for candidates who enjoy hands-on engineering work and are interested in developing as a Tool Owner and Process Owner within Intel's advanced manufacturing environment.

Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering discipline with 1+ year of relevant experience.
Master's degree in one of the above disciplines with no prior experience required.
PhD in one of the above disciplines with no prior experience required.
Knowledge of manufacturing process control and equipment adjustment.

Nice To Haves

Experience with Design of Experiments (DOE) principles and statistical data analysis.
Experience with Statistical Process Control (SPC).
Experience using process development or statistical analysis tools such as JMP or Python.
Experience troubleshooting engineering or manufacturing processes while collaborating with cross-functional teams.
Background in organic and inorganic materials and characterization techniques such as DSC, TGA, FTIR, XPS, SEM, or similar.
Familiarity with machine learning techniques and relational databases for data analysis and modeling.

Responsibilities

Develop and support advanced assembly processes and equipment for next-generation substrate packaging technologies.
Plan and execute Design of Experiments (DOEs) to support process optimization and evaluate process, material, and equipment interactions.
Apply statistical analysis and data-driven methodologies to improve quality, reliability, process capability, manufacturing efficiency, and cost.
Partner with Procurement and Supplier Quality teams to establish material specifications and support supplier performance and material quality.
Contribute to process improvements through continuous improvement methodologies and engineering best practices.
Troubleshoot packaging and manufacturing issues using engineering principles and analytical problem-solving techniques.
Collaborate with cross-functional teams to resolve process and technology challenges supporting substrate technology development.
Support process documentation, standardization activities, and preventive and corrective maintenance procedures.
Work with equipment and material suppliers to support the development and qualification of new tools and materials.
Contribute to the design, development, and qualification of advanced substrate packaging technologies, including EMIB and Co-EMIB.