Module Development Engineer (Adv Packaging)

Intel • Hillsboro, OR

9d • Onsite

About The Position

The primary responsibilities for this role will include, but are not limited to:Driving technology development enables both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.Performs path-finding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmaps.Recommends and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.

Requirements

• Minimum qualifications are required to be initially considered for this position.
• Bachelor's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics with 3+ years of relevant experience OR a Master's in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics with 2+ years of experience OR a PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics
• Relevant Experience must include the following:

Nice To Haves

• 3+ years of direct Wafer Level Assembly module engineering OR Fab process/hardware technology development experience.
• Direct packaging experience in the areas of Thermocompression or Hybrid Bond technology.
• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Responsibilities

• Driving technology development enables both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
• Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Performs path-finding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmaps.
• Recommends and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
• Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
• Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level