The MRSI Die Bonding Assembly Technician is responsible for the high-precision attachment of semiconductor dies to substrates, specifically within the production of RF and microwave components. This role requires extreme attention to detail, mastery of micro-assembly techniques, and the ability to work under high-magnification optics to ensure the electrical and mechanical integrity of mission-critical components. This position supports our Weekend Day Shift working Friday, Saturday and Sunday from 3:00 AM to 3:00 PM. You will work 36 Hours and be paid for 40 Hours plus earn a 10% pay premium.
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Job Type
Full-time
Career Level
Mid Level
Education Level
High school or GED