Principal/Senior Principal Microelectronics Product Engineer

Northrop Grumman•Linthicum Heights, MD
•$108,800 - $203,600•Onsite

About The Position

Northrop Grumman Mission Systems’ Microelectronics Center is seeking a Microelectronics Product Engineer for its Advanced Technology Lab outside Baltimore, Maryland. The lab designs, manufactures, and tests semiconductor products for internal and commercial production customers and emerging technology programs. Its foundry supports production devices made from silicon, gallium arsenide, gallium nitride, and silicon carbide, as well as development of superconducting electronics. These devices support Northrop Grumman ground-based and avionic radars and space systems. The position serves as product engineering lead for backend test and assembly activities. The engineer generates and maintains product trip tickets, monitors delivery and yield metrics, resolves technical issues, and leads efforts to improve cost and schedule across a technology sector. The role works closely with program managers, functional engineering teams—including product, test, assembly, design, process, and quality—and operations, acting as the engineering point of contact for product-related technical and production issues. The position may be filled at the Principal or Senior Principal level, depending on qualifications.

Requirements

  • For the Principal level: a bachelor's degree in Electrical Engineering or a STEM-related discipline and 5 years of experience, a master's degree and 3 years of experience, or a Ph.D. and 1 year of related experience.
  • For the Senior Principal level: a bachelor's degree in Electrical Engineering or a STEM-related discipline and 8 years of experience, a master's degree and 6 years of experience, or a Ph.D. and 3 years of related experience.
  • Experience with root cause investigations and corrective actions (RCCA).
  • Experience leading and implementing design changes and process changes using industry-standard change controls.
  • General understanding of semiconductor processing.
  • U.S. citizenship required.
  • Ability to obtain and maintain a Secret clearance.

Nice To Haves

  • Six Sigma Green Belt certification.
  • Project management experience.
  • Yield enhancement or manufacturing experience, including Six Sigma disciplines.
  • Experience with JMP, Python, Tableau, or other programming and data analysis software.
  • Experience with microelectronics product ownership.
  • Background in solid-state physics or another relevant engineering or physical science discipline.
  • Understanding of analog, digital, and RF device test and characterization techniques.
  • Familiarity with semiconductor product qualification tests and industry standards.
  • Current Secret clearance.
  • Cross-functional experience in process engineering or quality engineering.

Responsibilities

  • Lead product engineering activities for semiconductor product backend test and assembly.
  • Generate and maintain product backend trip tickets for test and assembly.
  • Track and monitor program delivery and yield metrics.
  • Resolve product-related technical and production issues.
  • Lead team efforts to improve cost and schedule across a technology sector.
  • Coordinate with program managers, functional engineering staff, and operations as the engineering point of contact for product issues.
  • Lead and implement design changes and process changes through industry-standard change controls.
  • Conduct root cause investigations and corrective actions (RCCA).

Benefits

  • Health insurance coverage.
  • Life insurance.
  • Disability insurance.
  • Savings plan.
  • Company-paid holidays.
  • Paid time off (PTO) for vacation and/or personal business.
  • Employees may be eligible for overtime, shift differential, and a discretionary bonus, depending on the position.
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