Micro-electronics Technician - Weekend Shift

Anduril • Hudson, NH

7d • Onsite

About The Position

Advanced Infrared Solutions (AIRS), formerly American Infrared Solutions, was acquired by Anduril Industries in 2025 and operates as part of the Imaging Business Line. AIRS designs and builds cooled infrared cameras and subsystems, including Integrated Dewar Cooler Assemblies (IDCAs), and is expanding production for both Anduril products and external customers. This role supports that production from the AIRS site in Hudson, New Hampshire, on a weekend shift: Thursday–Sunday or Friday–Sunday.

The Micro-electronics Technician performs precise wire bonding and microelectronic assembly, interprets technical documentation, sets up and adjusts equipment, and inspects work to ensure it meets design and quality requirements. The role involves close collaboration with technicians and engineers to troubleshoot production issues and improve processes, while maintaining cleanroom, safety, and ESD standards.

Requirements

• High school diploma or equivalent.
• Hands-on experience in wire bonding or microelectronic manufacturing, or equivalent practical skills gained through a related technical bootcamp or certification program.
• Proficiency in wire bonding techniques, including manual gold ball, wedge, and ribbon bonding, as well as semi-automatic and automated bonding.
• Experience with intricate microelectronic assembly, including precise adhesive and epoxy application.
• Exceptional manual dexterity and ability to work consistently and accurately under a microscope for an entire shift.
• Ability to read, interpret, and follow detailed technical documentation, including build sheets, ICDs, and engineering drawings.
• Commitment to maintaining a clean, safe, and ESD-compliant work environment.
• Must be a U.S. Person due to required access to U.S. export-controlled information or facilities.

Responsibilities

• Operate and maintain manual, semi-automatic, and automated wire bonding equipment, including Westbond bonders.
• Perform gold ball, wedge, ribbon, alloy, and manganin wire bonding onto substrates and components such as duroid, ceramic, capacitors, resistors, diodes, and spirals.
• Perform microelectronic assembly, including mixing and applying adhesives, glues, and epoxies and integrating components such as temperature diodes, capacitors, and alumina materials.
• Read and interpret build sheets, Interface Control Documents (ICDs), and engineering drawings, following specifications and process requirements.
• Set up and calibrate wire bonding machinery, make minor adjustments, and optimize parameters such as loop heights.
• Conduct in-process and final inspections using measurement equipment such as a reticle, indicator, microscope, and bond puller.
• Collaborate with technicians, engineers, and other technical personnel to troubleshoot production problems and contribute to process improvements and parameter optimization.
• Meet quality, consistency, and work-rate standards while following cleanroom protocols, safety guidelines, and ESD procedures.

Benefits

• Highly competitive equity grants are included in the majority of full-time offers.
• Top-tier benefits for full-time employees, described as comprehensive and competitive and available at little to no cost to employees.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: High school or GED